Intel Corporation
5AGXBB3D4F40I5G
5AGXBB3D4F40I5G ECAD Model
5AGXBB3D4F40I5G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.1 V | |
| Number of Inputs | 704 | |
| Number of Outputs | 704 | |
| Number of Logic Cells | 362000 | |
| Number of CLBs | 13688 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 13688 CLBS | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1517 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
5AGXBB3D4F40I5G Datasheet Download
5AGXBB3D4F40I5G Overview
Chip model 5AGXBB3D4F40I5G is an advanced programmable logic device (PLD) designed for high-performance digital signal processing, embedded processing, image processing and other applications. It is based on the latest technology of Intel® Stratix® 10 FPGA, and is equipped with a large number of logic elements, memory blocks and DSP blocks. In addition, it supports a variety of HDL languages, such as Verilog, SystemVerilog, VHDL, and SystemC, which makes it suitable for advanced communication systems.
The chip model 5AGXBB3D4F40I5G is designed to provide high-performance and cost-effective solutions for the most demanding applications. It has the advantage of high-speed signal processing, low power consumption and scalability. With its advanced features, it can be used in various applications such as industrial automation, automotive, aerospace, medical and consumer electronics.
In terms of industry trends, the chip model 5AGXBB3D4F40I5G is expected to benefit from the increasing demand for advanced communication systems. With the development of 5G technology, the demand for high-performance and cost-effective solutions is expected to grow. Moreover, the development of artificial intelligence (AI) and machine learning (ML) technologies will also drive the demand for the chip model 5AGXBB3D4F40I5G.
The original design intention of the chip model 5AGXBB3D4F40I5G is to provide a high-performance and cost-effective solution for the most demanding applications. It has the advantage of high-speed signal processing, low power consumption and scalability. The chip model 5AGXBB3D4F40I5G is also designed to be able to support future upgrades and new technologies. With its advanced features, it can be applied to advanced communication systems.
In conclusion, chip model 5AGXBB3D4F40I5G is a high-performance and cost-effective solution for the most demanding applications. It is designed to support future upgrades and new technologies, and it is expected to benefit from the increasing demand for advanced communication systems. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications.
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5,164 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,699.9441 | $5,699.9441 |
| 10+ | $5,638.6544 | $56,386.5442 |
| 100+ | $5,332.2058 | $533,220.5814 |
| 1000+ | $5,025.7572 | $2,512,878.6020 |
| 10000+ | $4,596.7292 | $4,596,729.1500 |
| The price is for reference only, please refer to the actual quotation! | ||