Intel Corporation
5AGXBB3D4F35C5G
5AGXBB3D4F35C5G ECAD Model
5AGXBB3D4F35C5G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.1 V | |
| Number of Inputs | 704 | |
| Number of Outputs | 704 | |
| Number of Logic Cells | 362000 | |
| Number of CLBs | 13688 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 13688 CLBS | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
5AGXBB3D4F35C5G Datasheet Download
5AGXBB3D4F35C5G Overview
The chip model 5AGXBB3D4F35C5G is a powerful tool for developers in a variety of industries. This model has many advantages that make it an attractive choice for developers. It is a highly integrated device with an advanced architecture that allows for the integration of multiple components on a single chip. This makes it ideal for applications where a high level of integration is needed. Additionally, it is a low-power device, which makes it suitable for applications where power consumption is a priority.
The 5AGXBB3D4F35C5G model is designed to meet the needs of developers in a variety of industries. It is suitable for a wide range of applications, including communications, automotive, consumer electronics, medical and industrial. As such, it is expected that the demand for this model will continue to grow in the future.
The original design intention of the 5AGXBB3D4F35C5G model was to provide a highly integrated device with an advanced architecture. This allows for the integration of multiple components on a single chip and makes it ideal for applications where a high level of integration is needed. The model also has the ability to be upgraded in the future, allowing developers to keep up with the latest technologies and trends.
The 5AGXBB3D4F35C5G model is also suitable for use in the development and popularization of future intelligent robots. It is capable of providing the necessary computing power and intelligence for robots to interact with their environment. In order to use this model effectively, developers will need to have a good understanding of computer science, robotics, and artificial intelligence.
In conclusion, the chip model 5AGXBB3D4F35C5G is a powerful tool for developers in a variety of industries. It is a highly integrated device with an advanced architecture that allows for the integration of multiple components on a single chip. It is also low-power and suitable for a wide range of applications. Additionally, it is capable of being upgraded in the future and can be used for the development and popularization of future intelligent robots. Developers who wish to use this model effectively will need to have a good understanding of computer science, robotics, and artificial intelligence.
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5,623 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,369.3754 | $4,369.3754 |
| 10+ | $4,322.3929 | $43,223.9285 |
| 100+ | $4,087.4802 | $408,748.0197 |
| 1000+ | $3,852.5675 | $1,926,283.7710 |
| 10000+ | $3,523.6898 | $3,523,689.8250 |
| The price is for reference only, please refer to the actual quotation! | ||