Intel Corporation
5AGXBA3D4F27I5G
5AGXBA3D4F27I5G ECAD Model
5AGXBA3D4F27I5G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.1 V | |
| Number of Inputs | 416 | |
| Number of Outputs | 416 | |
| Number of Logic Cells | 156000 | |
| Number of CLBs | 5890 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 5890 CLBS | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-672 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
5AGXBA3D4F27I5G Datasheet Download
5AGXBA3D4F27I5G Overview
The chip model 5AGXBA3D4F27I5G is a powerful, efficient and reliable integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to use hardware description language (HDL) to enable users to quickly and accurately develop and deploy sophisticated applications.
In terms of industry trends, the chip model 5AGXBA3D4F27I5G is designed to take advantage of the latest advancements in digital signal processing and embedded processing technology. This chip can be used in a wide range of applications, such as image processing, high-speed communications, and industrial automation. Its potential for future upgrades is also impressive.
The original design intention of the chip model 5AGXBA3D4F27I5G was to create a powerful, efficient, and reliable integrated circuit suitable for a wide range of applications. Its design also allows for future upgrades and improvements, making it a great choice for a wide range of applications. Additionally, the chip can be used in advanced communication systems, providing a great solution for those needing reliable, high-speed communication.
In terms of whether the application environment requires the support of new technologies, it depends on what specific technologies are needed. For example, if a user needs to use advanced image processing algorithms, then the chip model 5AGXBA3D4F27I5G will need to support the appropriate technologies. Similarly, if the user needs to use advanced communication protocols, then the chip model 5AGXBA3D4F27I5G will need to support the appropriate protocols.
Overall, the chip model 5AGXBA3D4F27I5G is a powerful, efficient, and reliable integrated circuit designed for a wide range of applications. It is designed to use hardware description language (HDL) to enable users to quickly and accurately develop and deploy sophisticated applications. Additionally, its design allows for future upgrades and improvements, making it a great choice for a wide range of applications. Finally, the chip can be used in advanced communication systems, providing a great solution for those needing reliable, high-speed communication.
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5,025 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $470.7147 | $470.7147 |
| 10+ | $465.6532 | $4,656.5322 |
| 100+ | $440.3460 | $44,034.5976 |
| 1000+ | $415.0387 | $207,519.3680 |
| 10000+ | $379.6086 | $379,608.6000 |
| The price is for reference only, please refer to the actual quotation! | ||