Intel Corporation
5AGXBA1D4F27C5G
5AGXBA1D4F27C5G ECAD Model
5AGXBA1D4F27C5G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.1 V | |
| Number of Inputs | 416 | |
| Number of Outputs | 416 | |
| Number of Logic Cells | 75000 | |
| Number of CLBs | 2830 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 2830 CLBS | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-672 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991 |
5AGXBA1D4F27C5G Datasheet Download
5AGXBA1D4F27C5G Overview
The chip model 5AGXBA1D4F27C5G is a highly advanced integrated circuit developed by Altera Corporation, one of the world's leading semiconductor companies. This chip model is designed to enable advanced communication systems and networks, with a focus on providing high-speed data transmission and reliable performance. It is capable of handling a wide range of data protocols and can be used in a variety of applications, from consumer electronics to industrial automation.
The original design intention of the chip model 5AGXBA1D4F27C5G was to enable advanced communication systems and networks. The chip model is designed to support a wide range of data protocols, including Ethernet, Wi-Fi, and Bluetooth. It also has the capability to support multiple data rates, allowing it to be used in applications that require high-speed data transmission. Furthermore, the chip model is designed to be highly reliable, with a focus on providing a stable and secure connection.
In terms of future upgrades, the chip model 5AGXBA1D4F27C5G can be upgraded to support more advanced features. For example, the chip model can be upgraded with support for 5G networks, allowing for faster data transmission and improved performance. Additionally, the chip model can be upgraded to support artificial intelligence (AI) and machine learning (ML) applications, allowing it to be used in more intelligent scenarios.
The chip model 5AGXBA1D4F27C5G can also be applied to the development and popularization of future intelligent robots. It can be used to control and monitor the robots, as well as to provide them with the necessary data for decision-making. In order for the chip model to be used effectively in this application, technical talents such as AI/ML engineers and roboticists are required.
Overall, the chip model 5AGXBA1D4F27C5G is an advanced integrated circuit designed to enable advanced communication systems and networks. It is capable of handling a wide range of data protocols and can be upgraded to support more advanced features. Additionally, it can be applied to the development and popularization of future intelligent robots, although technical talents are needed to use the model effectively.
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5,133 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $864.4973 | $864.4973 |
| 10+ | $855.2016 | $8,552.0164 |
| 100+ | $808.7233 | $80,872.3290 |
| 1000+ | $762.2449 | $381,122.4700 |
| 10000+ | $697.1753 | $697,175.2500 |
| The price is for reference only, please refer to the actual quotation! | ||