1SX250HU3F50E3VG
1SX250HU3F50E3VG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

1SX250HU3F50E3VG


1SX250HU3F50E3VG
F18-1SX250HU3F50E3VG
Active
IC FPGA STRATIX 10 2397FBGA
2397-FBGA, FC (50x50)

1SX250HU3F50E3VG ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

1SX250HU3F50E3VG Attributes


Type Description Select

1SX250HU3F50E3VG Overview



The chip model 1SX250HU3F50E3VG is a high-performance, multi-functional chip designed for digital signal processing, embedded processing, and image processing. It is a versatile chip that can be used in a variety of industries, such as automotive, medical, and consumer electronics. In addition, it requires the use of HDL language, which is a powerful and versatile language used in the design of digital systems.


The 1SX250HU3F50E3VG chip offers a variety of advantages, including low power consumption, high performance, and high integration. It is also highly scalable, meaning that it can be tailored to meet the specific needs of different applications. Moreover, its modular architecture allows for easy integration with other components, making it an ideal choice for embedded systems.


The 1SX250HU3F50E3VG chip is expected to be in high demand in the coming years as more industries adopt it for their applications. This is due to its ability to provide high performance and low power consumption in a compact, cost-effective package. Furthermore, its modular design makes it easy to integrate with other components, making it a great choice for embedded systems.


When designing the 1SX250HU3F50E3VG chip, it is important to consider the specific requirements of the application. This includes the type of processor, memory, and other components that will be used. Additionally, the design should take into account the power consumption, operating temperature, and other environmental factors. Furthermore, the design should also include safety measures, such as ESD protection, to ensure the chip is safe to operate.


To ensure the successful implementation of the 1SX250HU3F50E3VG chip, it is important to follow the design guidelines provided by the manufacturer. Additionally, it is important to use the HDL language correctly and to thoroughly test the design before deployment. There are numerous case studies and tutorials available to help designers understand the chip and its capabilities. Lastly, it is important to take into account the safety measures that are necessary to ensure the chip is safe to operate.



2,493 In Stock


I want to buy

Unit Price: $10,094.2812
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $9,387.6815 $9,387.6815
10+ $9,286.7387 $92,867.3870
100+ $8,782.0246 $878,202.4644
1000+ $8,277.3106 $4,138,655.2920
10000+ $7,570.7109 $7,570,710.9000
The price is for reference only, please refer to the actual quotation!

Quick Quote