1SG280HU3F50I2LG
1SG280HU3F50I2LG
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rohs

Intel Corporation

1SG280HU3F50I2LG


1SG280HU3F50I2LG
F18-1SG280HU3F50I2LG
Active
FIELD PROGRAMMABLE GATE ARRAY
2397-FBGA, FC (50x50)

1SG280HU3F50I2LG ECAD Model


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1SG280HU3F50I2LG Attributes


Type Description Select
Part Life Cycle Code Active
Supply Voltage-Nom 850 mV
Number of Inputs 736
Number of Outputs 736
Number of Logic Cells 2753000
Number of CLBs 344125
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Organization 344125 CLBS
Supply Voltage-Max 880 mV
Supply Voltage-Min 820 mV
JESD-30 Code S-PBGA-B2397
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 2397
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA2397,49X49,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 50 mm
Length 50 mm
Seated Height-Max 3.881 mm
Ihs Manufacturer INTEL CORP
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Date Of Intro 2018-08-08

1SG280HU3F50I2LG Datasheet Download


1SG280HU3F50I2LG Overview



The chip model 1SG280HU3F50I2LG is a powerful tool for modern technology. It is the latest chip model of the 1SG series and has been designed to meet the needs of today's ever-changing technology landscape. With its high speed and low power consumption, it is suitable for a wide range of applications.


The chip model 1SG280HU3F50I2LG is designed to be highly scalable and can be used in a variety of different scenarios. Its advanced power management and low power consumption make it an ideal choice for applications that require high performance and low power consumption. This chip model is also designed to be highly reliable and can be used in a variety of mission-critical applications.


In terms of industry trends, the chip model 1SG280HU3F50I2LG is well-positioned to meet the needs of today's technology landscape. It is capable of supporting new technologies, such as 5G and artificial intelligence, which are becoming increasingly important in the modern world. It is also capable of supporting advanced communication systems, such as the Internet of Things (IoT) and wireless communication systems.


The chip model 1SG280HU3F50I2LG is also well-suited for use in networks and intelligent scenarios. Its high speed and low power consumption make it an ideal choice for applications that require high performance and low power consumption. Its advanced power management and low power consumption make it an ideal choice for applications that require high performance and low power consumption. In addition, its scalability makes it an ideal choice for applications that require a high degree of flexibility.


The chip model 1SG280HU3F50I2LG is also well-suited for use in the era of fully intelligent systems. Its scalability and advanced power management make it an ideal choice for applications that require high performance and low power consumption. Its advanced power management and low power consumption make it an ideal choice for applications that require a high degree of flexibility.


Overall, the chip model 1SG280HU3F50I2LG is an ideal choice for a wide range of applications. Its scalability, advanced power management, and low power consumption make it an ideal choice for applications that require high performance and low power consumption. Its scalability and advanced power management make it an ideal choice for applications that require a high degree of flexibility. With its high speed and low power consumption, it is suitable for a wide range of applications and is well-positioned to meet the needs of today's ever-changing technology landscape.



2,942 In Stock


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Unit Price: $19,807.5862
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $18,421.0552 $18,421.0552
10+ $18,222.9793 $182,229.7930
100+ $17,232.6000 $1,723,259.9994
1000+ $16,242.2207 $8,121,110.3420
10000+ $14,855.6897 $14,855,689.6500
The price is for reference only, please refer to the actual quotation!

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