1SG280HU3F50E2VGS3
1SG280HU3F50E2VGS3
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Intel Corporation

1SG280HU3F50E2VGS3


1SG280HU3F50E2VGS3
F18-1SG280HU3F50E2VGS3
Active
IC FPGA 704 I/O 2397FBGA
2397-FBGA, FC (50x50)

1SG280HU3F50E2VGS3 ECAD Model


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1SG280HU3F50E2VGS3 Attributes


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1SG280HU3F50E2VGS3 Overview



The chip model 1SG280HU3F50E2VGS3 is a powerful and versatile integrated circuit (IC) that is suitable for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with a hardware description language (HDL) and has a number of advantages that make it an attractive option for many industries.


The 1SG280HU3F50E2VGS3 chip model has several features that make it particularly well-suited for these applications. It has a high-performance processor core, a high-speed memory system, and a wide range of peripherals. It also has an integrated power management system, which helps to reduce power consumption and extend the life of the device. Additionally, the device is designed to be highly reliable, with a long service life and low failure rate.


The expected demand for the 1SG280HU3F50E2VGS3 chip model is likely to increase in the near future due to its many advantages. It is well-suited for a wide range of applications, and its features make it a cost-effective solution for many industries. Additionally, its reliability and long service life make it a good choice for long-term projects.


When designing with the 1SG280HU3F50E2VGS3 chip model, it is important to have a clear understanding of the product description and design requirements. The device must be designed for the specific application, and the design must meet the requirements of the application. Additionally, the design must be tested and verified to ensure that it performs as expected. Additionally, it is important to consider any potential risks and precautions when using the device.


Case studies can be a useful resource when designing with the 1SG280HU3F50E2VGS3 chip model. By studying successful designs, designers can gain a better understanding of the device and how it can be used in various applications. Additionally, case studies can provide valuable insight into potential risks and precautions that should be taken when using the device.


The chip model 1SG280HU3F50E2VGS3 is a powerful and versatile integrated circuit that is suitable for a wide range of applications. It has a number of advantages that make it an attractive option for many industries, and its expected demand is likely to increase in the near future. When designing with the device, it is important to have a clear understanding of the product description and design requirements, and to consider any potential risks and precautions. Additionally, studying successful designs and case studies can provide valuable insight into how the device can be used in various applications.



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Unit Price: $64,762.3292
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $60,228.9662 $60,228.9662
10+ $59,581.3429 $595,813.4286
100+ $56,343.2264 $5,634,322.6404
1000+ $53,105.1099 $26,552,554.9720
10000+ $48,571.7469 $48,571,746.9000
The price is for reference only, please refer to the actual quotation!

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