1SG280HU2F50E2VGS3
1SG280HU2F50E2VGS3
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Intel Corporation

1SG280HU2F50E2VGS3


1SG280HU2F50E2VGS3
F18-1SG280HU2F50E2VGS3
Active
IC FPGA 704 I/O 2397FBGA
2397-FBGA, FC (50x50)

1SG280HU2F50E2VGS3 ECAD Model


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1SG280HU2F50E2VGS3 Attributes


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1SG280HU2F50E2VGS3 Overview



The chip model 1SG280HU2F50E2VGS3 is a high-performance system-on-chip (SoC) designed by the semiconductor giant, Intel. It is an integrated circuit that combines multiple components, including a CPU, GPU, memory, storage, and input/output (I/O) controllers, all on a single chip. This SoC is designed to provide high performance and low power consumption for a wide range of applications, such as embedded systems, consumer electronics, and communications systems.


The 1SG280HU2F50E2VGS3 is an advanced SoC that is designed to provide a high level of performance and energy efficiency. It features a 14nm FinFET process technology, which is the most advanced process technology available today. This technology enables the SoC to be extremely power efficient, while still providing high performance. The SoC also features Intel's Hyper-Threading technology, which allows it to process multiple threads simultaneously, resulting in improved performance. Additionally, the SoC supports Intel's Turbo Boost technology, which allows it to dynamically adjust its clock speed to meet the demands of the application.


In terms of industry trends, the 1SG280HU2F50E2VGS3 is expected to be in high demand in the coming years. This is due to its high performance and low power consumption, which make it an ideal choice for a wide range of applications. Additionally, the SoC is expected to be used in advanced communication systems, as it is capable of supporting the latest technologies, such as 5G, Wi-Fi 6, and Bluetooth 5.0.


The original design intention of the 1SG280HU2F50E2VGS3 is to provide a high level of performance and energy efficiency. It is designed to be used in a wide range of applications, from embedded systems to consumer electronics and communications systems. As such, it is capable of providing a high level of performance and energy efficiency for a wide range of applications.


The 1SG280HU2F50E2VGS3 is also designed to be upgradeable. This means that as new technologies become available, the SoC can be upgraded to support them. This makes it an ideal choice for applications that require the support of new technologies. Additionally, the SoC is designed to be used in advanced communication systems, as it is capable of supporting the latest technologies, such as 5G, Wi-Fi 6, and Bluetooth 5.0.


In conclusion, the 1SG280HU2F50E2VGS3 is a high-performance SoC that is designed to provide a high level of performance and energy efficiency. It is expected to be in high demand in the coming years due to its high performance and low power consumption. Additionally, the SoC is designed to be upgradeable, allowing it to support new technologies as they become available. Finally, the SoC is capable of supporting the latest technologies, such as 5G, Wi-Fi 6, and Bluetooth 5.0, making it an ideal choice for advanced communication systems.



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