1SG280HH3F55I3XG
1SG280HH3F55I3XG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

1SG280HH3F55I3XG


1SG280HH3F55I3XG
F18-1SG280HH3F55I3XG
Active
IC FPGA 1160 I/O 2912BGA
2912-FBGA, FC (55x55)

1SG280HH3F55I3XG ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

1SG280HH3F55I3XG Attributes


Type Description Select

1SG280HH3F55I3XG Overview



The chip model 1SG280HH3F55I3XG is a high performance and low power consumption integrated circuit designed for use in a variety of industries. It is designed to provide efficient, cost-effective solutions for a variety of applications, including automotive, industrial, consumer, and communication. Its main advantages are its low power consumption, high performance, and flexibility.


The expected demand trends for the model in related industries in the future are very positive. As technology continues to advance, the need for reliable and efficient integrated circuits is increasing. This chip model is expected to be in high demand in the coming years, as it provides a cost-effective solution to a variety of applications.


The original design intention of the chip model 1SG280HH3F55I3XG was to provide a high performance and low power consumption integrated circuit for use in a variety of industries. The chip model is designed to be flexible and able to be used in a variety of applications. It is also designed to be upgradable, so that it can be used in more advanced communication systems in the future.


The product description and specific design requirements of the chip model 1SG280HH3F55I3XG are as follows. It is a low power consumption, high performance integrated circuit with a maximum power consumption of 1.2W. It is designed to operate in temperatures ranging from -40°C to +85°C. It is also capable of operating in a wide range of voltages, from 1.5V to 5.5V. The chip model has a maximum clock frequency of 200MHz and is designed to be used in a variety of applications.


The chip model 1SG280HH3F55I3XG has been used in a variety of case studies, including automotive, industrial, consumer, and communication applications. In each of these cases, the chip model has provided a reliable and efficient solution. However, it is important to note that the chip model should be used with caution, as it is designed for a specific purpose and should not be used for any other applications.


In conclusion, the chip model 1SG280HH3F55I3XG is a high performance and low power consumption integrated circuit designed for use in a variety of industries. It is expected to be in high demand in the future, as it provides a cost-effective solution to a variety of applications. The chip model is designed to be upgradable, so that it can be used in more advanced communication systems in the future. Its product description and specific design requirements are outlined above, and it has been used in a variety of case studies. However, it is important to note that the chip model should be used with caution, as it is designed for a specific purpose and should not be used for any other applications.



1,603 In Stock


I want to buy

Unit Price: $17,749.4928
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $16,507.0283 $16,507.0283
10+ $16,329.5334 $163,295.3338
100+ $15,442.0587 $1,544,205.8736
1000+ $14,554.5841 $7,277,292.0480
10000+ $13,312.1196 $13,312,119.6000
The price is for reference only, please refer to the actual quotation!

Quick Quote