Intel Corporation
1SG280HH3F55E3XG
1SG280HH3F55E3XG ECAD Model
1SG280HH3F55E3XG Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 850 mV | |
| Number of Inputs | 1168 | |
| Number of Outputs | 1168 | |
| Number of Logic Cells | 2753000 | |
| Number of CLBs | 344125 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Organization | 344125 CLBS | |
| Supply Voltage-Max | 880 mV | |
| Supply Voltage-Min | 820 mV | |
| JESD-30 Code | S-PBGA-B2912 | |
| Operating Temperature-Max | 100 °C | |
| Number of Terminals | 2912 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA2912,54X54,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 55 mm | |
| Length | 55 mm | |
| Seated Height-Max | 3.881 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2018-08-08 |
1SG280HH3F55E3XG Datasheet Download
1SG280HH3F55E3XG Overview
The chip model 1SG280HH3F55E3XG is a high-performance, low-power integrated circuit from the semiconductor brand Silicon Genesis. It is a member of the 1SG280 series of chips and has a wide range of applications in various industries. Its main features include high speed, low power consumption, and a wide range of operating voltages.
The 1SG280HH3F55E3XG is designed for use in high-speed, low-power communication systems. It is capable of operating at speeds up to 8Gbps and can support a wide range of communication protocols, including Ethernet, USB, and Serial ATA. The chip also features a built-in clock generator, allowing it to be used in a wide range of applications.
The 1SG280HH3F55E3XG is designed to be used in the most advanced communication systems. It is capable of supporting the latest communication protocols, such as Wi-Fi 6, 5G, and Bluetooth 5.0. It also features advanced signal processing capabilities, allowing it to be used in a wide range of signal processing applications.
The 1SG280HH3F55E3XG is designed to be a cost-effective solution for a wide range of applications. It is designed to be both reliable and energy-efficient, making it suitable for a wide range of applications. It is also designed to be easily upgradeable, allowing it to be used in the future as new technologies become available.
The 1SG280HH3F55E3XG is expected to be in high demand in the future, as it is suitable for a wide range of applications. Its low power consumption and wide range of support for communication protocols make it suitable for use in a wide range of industries, including automotive, medical, and industrial. Its advanced signal processing capabilities make it suitable for use in a wide range of signal processing applications.
In conclusion, the 1SG280HH3F55E3XG is a high-performance, low-power integrated circuit designed for use in the most advanced communication systems. It has a wide range of applications and is expected to be in high demand in the future. Its low power consumption, wide range of support for communication protocols, and advanced signal processing capabilities make it suitable for a wide range of applications. It is designed to be both reliable and energy-efficient, and is also designed to be easily upgradeable, allowing it to be used in the future as new technologies become available.
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4,372 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $13,755.8662 | $13,755.8662 |
| 10+ | $13,607.9537 | $136,079.5368 |
| 100+ | $12,868.3910 | $1,286,839.0980 |
| 1000+ | $12,128.8283 | $6,064,414.1400 |
| 10000+ | $11,093.4405 | $11,093,440.5000 |
| The price is for reference only, please refer to the actual quotation! | ||