1SG280HH3F55E2LG
1SG280HH3F55E2LG
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Intel Corporation

1SG280HH3F55E2LG


1SG280HH3F55E2LG
F18-1SG280HH3F55E2LG
Active
IC FPGA 1160 I/O 2912BGA
2912-FBGA, FC (55x55)

1SG280HH3F55E2LG ECAD Model


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1SG280HH3F55E2LG Attributes


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1SG280HH3F55E2LG Overview



The chip model 1SG280HH3F55E2LG is a new generation of advanced integrated circuit that has been developed to meet the current and future needs of the electronics industry. It is a highly advanced and sophisticated integrated circuit that is designed to provide superior performance and reliability. This chip model is designed to provide a high level of performance, as well as a high degree of reliability, in order to meet the needs of the current and future electronics industry.


The chip model 1SG280HH3F55E2LG has several advantages that make it an ideal choice for a wide range of applications. Firstly, it is designed to be highly efficient and power-saving, allowing it to be used in a wide range of applications. Secondly, it is designed to be highly reliable, which ensures that it can be used in a variety of applications for a long period of time. Finally, it has a high degree of flexibility, allowing it to be used in different types of applications.


The chip model 1SG280HH3F55E2LG is expected to be in high demand in the future due to its advanced features and capabilities. It is expected to be used in a wide range of applications, including but not limited to, high-speed communication systems, wireless networks, and other intelligent systems. It is also expected to be used in the era of fully intelligent systems, as it is designed to provide a high degree of flexibility and reliability.


The original design intention of the chip model 1SG280HH3F55E2LG was to provide a highly efficient and reliable integrated circuit that could be used in a wide variety of applications. It was designed with the intention of providing a high degree of performance and reliability, as well as a high degree of flexibility. The chip model is also designed with the intention of being able to be upgraded in the future, allowing it to be used in more advanced communication systems and networks.


The chip model 1SG280HH3F55E2LG is expected to be used in a wide range of applications in the future. It is expected to be used in high-speed communication systems, wireless networks, and other intelligent systems. It is also expected to be used in the era of fully intelligent systems, as it is designed to provide a high degree of flexibility and reliability. Additionally, it is expected to be used in a variety of scenarios, such as home automation, healthcare, and industrial automation.


In conclusion, the chip model 1SG280HH3F55E2LG is an advanced integrated circuit that is designed to provide superior performance and reliability. It is expected to be in high demand in the future due to its advanced features and capabilities. It is also designed with the intention of being able to be upgraded in the future, allowing it to be used in more advanced communication systems and networks. Finally, it is expected to be used in a wide range of applications, including but not limited to, high-speed communication systems, wireless networks, and other intelligent systems.



1,107 In Stock


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Unit Price: $13,866.9071
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $12,896.2236 $12,896.2236
10+ $12,757.5545 $127,575.5453
100+ $12,064.2092 $1,206,420.9177
1000+ $11,370.8638 $5,685,431.9110
10000+ $10,400.1803 $10,400,180.3250
The price is for reference only, please refer to the actual quotation!

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