10M50DCF484I6G
10M50DCF484I6G
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10M50DCF484I6G


10M50DCF484I6G
F18-10M50DCF484I6G
Active
FIELD PROGRAMMABLE GATE ARRAY, FBGA-484
FBGA-484

10M50DCF484I6G ECAD Model


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10M50DCF484I6G Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 500
Number of Outputs 500
Number of Logic Cells 50000
Number of CLBs 3125
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Organization 3125 CLBS
Supply Voltage-Max 1.25 V
Supply Voltage-Min 1.15 V
JESD-30 Code S-PBGA-B484
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-484
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10M50DCF484I6G Datasheet Download


10M50DCF484I6G Overview



The chip model 10M50DCF484I6G has been a major player in the semiconductor industry for many years. It is a powerful, low-cost, and energy-efficient device that has been used in a variety of applications, from consumer electronics to industrial automation. With its high performance, low power consumption, and small size, the 10M50DCF484I6G is an attractive option for many applications.


The 10M50DCF484I6G has a wide range of features that have made it a popular choice for many applications. It offers a high-speed, low-power processor with a wide range of peripherals, including USB, Ethernet, and CAN bus interfaces. It also has a wide range of memory options, including SRAM, DRAM, and Flash, allowing it to be used in a variety of applications.


The 10M50DCF484I6G has been used in a variety of applications, from consumer electronics to industrial automation. It has been used in medical devices, automotive systems, and industrial equipment. It has also been used in a variety of networks, including Ethernet, CAN bus, and Wi-Fi. The 10M50DCF484I6G is a powerful, low-cost, and energy-efficient device that can be used in a variety of applications.


Looking to the future, the 10M50DCF484I6G is expected to remain a popular choice for many applications. As the demand for intelligent systems grows, the 10M50DCF484I6G is expected to be used in a variety of intelligent scenarios. The 10M50DCF484I6G is well-suited for use in networks, such as Ethernet, CAN bus, and Wi-Fi. It is also expected to be used in a variety of intelligent systems, such as autonomous vehicles, robotics, and the Internet of Things (IoT).


The 10M50DCF484I6G is an attractive option for many applications due to its high performance, low power consumption, and small size. It is expected to remain a popular choice for many applications in the future, as the demand for intelligent systems grows and the need for new technologies arises. The 10M50DCF484I6G is well-suited for use in a variety of networks and intelligent scenarios. As the demand for intelligent systems grows, the 10M50DCF484I6G is expected to be an important part of the future of the semiconductor industry.



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