
Intel Corporation
10M50DCF484I6G
10M50DCF484I6G ECAD Model
10M50DCF484I6G Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 500 | |
Number of Outputs | 500 | |
Number of Logic Cells | 50000 | |
Number of CLBs | 3125 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Organization | 3125 CLBS | |
Supply Voltage-Max | 1.25 V | |
Supply Voltage-Min | 1.15 V | |
JESD-30 Code | S-PBGA-B484 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 484 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-484 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10M50DCF484I6G Datasheet Download
10M50DCF484I6G Overview
The chip model 10M50DCF484I6G has been a major player in the semiconductor industry for many years. It is a powerful, low-cost, and energy-efficient device that has been used in a variety of applications, from consumer electronics to industrial automation. With its high performance, low power consumption, and small size, the 10M50DCF484I6G is an attractive option for many applications.
The 10M50DCF484I6G has a wide range of features that have made it a popular choice for many applications. It offers a high-speed, low-power processor with a wide range of peripherals, including USB, Ethernet, and CAN bus interfaces. It also has a wide range of memory options, including SRAM, DRAM, and Flash, allowing it to be used in a variety of applications.
The 10M50DCF484I6G has been used in a variety of applications, from consumer electronics to industrial automation. It has been used in medical devices, automotive systems, and industrial equipment. It has also been used in a variety of networks, including Ethernet, CAN bus, and Wi-Fi. The 10M50DCF484I6G is a powerful, low-cost, and energy-efficient device that can be used in a variety of applications.
Looking to the future, the 10M50DCF484I6G is expected to remain a popular choice for many applications. As the demand for intelligent systems grows, the 10M50DCF484I6G is expected to be used in a variety of intelligent scenarios. The 10M50DCF484I6G is well-suited for use in networks, such as Ethernet, CAN bus, and Wi-Fi. It is also expected to be used in a variety of intelligent systems, such as autonomous vehicles, robotics, and the Internet of Things (IoT).
The 10M50DCF484I6G is an attractive option for many applications due to its high performance, low power consumption, and small size. It is expected to remain a popular choice for many applications in the future, as the demand for intelligent systems grows and the need for new technologies arises. The 10M50DCF484I6G is well-suited for use in a variety of networks and intelligent scenarios. As the demand for intelligent systems grows, the 10M50DCF484I6G is expected to be an important part of the future of the semiconductor industry.
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Pricing (USD)
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