Intel Corporation
10M50DCF256I6G
10M50DCF256I6G ECAD Model
10M50DCF256I6G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 500 | |
| Number of Outputs | 500 | |
| Number of Logic Cells | 50000 | |
| Number of CLBs | 3125 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 3125 CLBS | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
10M50DCF256I6G Datasheet Download
10M50DCF256I6G Overview
The chip model 10M50DCF256I6G is a powerful and reliable integrated circuit designed to be used in a wide range of applications. It is designed to be a versatile and cost-effective solution for a variety of applications, from automotive to industrial, from consumer electronics to communication systems.
The original design intention of the chip model 10M50DCF256I6G was to provide a reliable, efficient and cost-effective solution for a variety of applications. It is capable of performing a variety of tasks, such as data processing, memory management, communication protocols and control systems. Furthermore, the chip model 10M50DCF256I6G is designed to be highly scalable, allowing for future upgrades and modifications.
The chip model 10M50DCF256I6G can be applied to advanced communication systems. It is capable of handling a wide range of communication protocols, from Ethernet to Wi-Fi, from Bluetooth to Zigbee. Furthermore, it is capable of handling a variety of data formats, from audio and video to text and images. It can also be used to develop and manage intelligent systems, such as machine learning and artificial intelligence.
The chip model 10M50DCF256I6G can also be used in the development and popularization of future intelligent robots. It is capable of handling complex tasks, such as motion control, navigation and path planning. Furthermore, it is capable of handling a variety of data formats, from audio and video to text and images. It is also capable of managing a variety of communication protocols, from Ethernet to Wi-Fi, from Bluetooth to Zigbee.
In order to effectively use the chip model 10M50DCF256I6G, technical talents are needed to understand the underlying principles of the chip, as well as the different communication protocols and data formats. Furthermore, knowledge of programming languages, such as C++, is also necessary in order to develop and manage intelligent systems. Finally, knowledge of robotics and artificial intelligence is also necessary in order to effectively use the chip model 10M50DCF256I6G in the development and popularization of future intelligent robots.
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2,738 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $43.0623 | $43.0623 |
| 10+ | $42.5993 | $425.9931 |
| 100+ | $40.2841 | $4,028.4132 |
| 1000+ | $37.9690 | $18,984.4760 |
| 10000+ | $34.7277 | $34,727.7000 |
| The price is for reference only, please refer to the actual quotation! | ||