Intel Corporation
10M50DAF672C8G
10M50DAF672C8G ECAD Model
10M50DAF672C8G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 500 | |
| Number of Outputs | 500 | |
| Number of Logic Cells | 50000 | |
| Number of CLBs | 3125 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 3125 CLBS | |
| Power Supplies | 1.2 V | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-672 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10M50DAF672C8G Datasheet Download
10M50DAF672C8G Overview
The chip model 10M50DAF672C8G is a device designed to provide powerful computing capabilities to a variety of applications. With its powerful resources and design, it is capable of handling complex tasks with ease. It is a powerful tool for a variety of applications, from communication systems to intelligent robots.
The original design intention of the chip model 10M50DAF672C8G was to provide a powerful platform for a variety of applications. It is capable of handling a wide range of tasks, from basic computing to advanced communication systems. It is also capable of being upgraded with new features and capabilities, allowing it to keep up with the ever-evolving technology landscape.
The chip model 10M50DAF672C8G is capable of being used in a variety of network scenarios. It can be used to create powerful local area networks (LANs) as well as complex wide area networks (WANs). It can also be used to create intelligent systems, such as artificial intelligence (AI) and machine learning (ML) systems. It is also capable of being used in the era of fully intelligent systems, such as the Internet of Things (IoT).
The chip model 10M50DAF672C8G can also be applied to the development and popularization of future intelligent robots. Its powerful capabilities can be used to create powerful robots that can interact with their environment and perform complex tasks. In order to use the chip model 10M50DAF672C8G effectively, it requires technical talents such as software developers, AI experts, and robotics engineers.
In conclusion, the chip model 10M50DAF672C8G is a powerful device that can be used for a variety of applications. It is capable of being upgraded with new features and capabilities, allowing it to keep up with the ever-evolving technology landscape. It is also capable of being used in a variety of network scenarios, as well as in the development and popularization of future intelligent robots. In order to use the chip model 10M50DAF672C8G effectively, it requires technical talents such as software developers, AI experts, and robotics engineers.
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3,033 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $159.1401 | $159.1401 |
| 10+ | $157.4289 | $1,574.2893 |
| 100+ | $148.8730 | $14,887.3008 |
| 1000+ | $140.3171 | $70,158.5440 |
| 10000+ | $128.3388 | $128,338.8000 |
| The price is for reference only, please refer to the actual quotation! | ||