
Intel Corporation
10M50DAF672C7G
10M50DAF672C7G ECAD Model
10M50DAF672C7G Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 500 | |
Number of Outputs | 500 | |
Number of Logic Cells | 50000 | |
Number of CLBs | 3125 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 3125 CLBS | |
Power Supplies | 1.2 V | |
Supply Voltage-Max | 1.25 V | |
Supply Voltage-Min | 1.15 V | |
JESD-30 Code | S-PBGA-B672 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 672 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA672,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-672 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10M50DAF672C7G Datasheet Download
10M50DAF672C7G Overview
The chip model 10M50DAF672C7G is a high-performance and low-power FPGA chip developed by Intel Corporation. It is the latest FPGA chip in the 10M50 series and has been designed to meet the needs of a wide range of applications. The chip offers a variety of features and benefits, such as high-speed operation, low power consumption, and a wide range of programmable logic.
The 10M50DAF672C7G chip is designed for high-performance computing and digital signal processing applications. It is capable of delivering up to 672K logic elements and up to 8 TeraFLOPS of performance. It also supports up to 1.5 terabits of memory bandwidth, making it suitable for a wide range of applications. The chip is also designed for high-speed data transfers, with support for up to 4x PCIe Gen3 lanes and up to 8x USB 3.0 ports.
The 10M50DAF672C7G chip is ideal for applications that require high-performance computing and digital signal processing, such as machine learning, artificial intelligence, and image processing. It is also suitable for applications that require a high degree of flexibility, such as embedded systems and communications systems. In addition, the chip is also suitable for applications that require high-speed data transfers, such as medical imaging and video streaming.
In terms of industry trends, the 10M50DAF672C7G chip is expected to be in high demand in the near future, as the demand for high-performance computing and digital signal processing applications continues to grow. The chip is also expected to be in high demand for applications that require a high degree of flexibility, such as embedded systems and communications systems. Furthermore, the chip is also expected to be in high demand for applications that require high-speed data transfers, such as medical imaging and video streaming.
When it comes to product design and specific requirements, the 10M50DAF672C7G chip is designed to meet a wide range of requirements. It is designed to be compatible with a variety of operating systems, including Windows, Linux, and Mac OS X. It is also designed to be compatible with a wide range of programming languages, such as Verilog, VHDL, and SystemVerilog. Furthermore, the chip is designed to be compatible with a wide range of development tools, such as Altera Quartus Prime, Xilinx Vivado, and Intel Quartus Prime.
When it comes to actual case studies, the 10M50DAF672C7G chip has been used in a variety of projects, such as the development of a high-performance computing platform for machine learning applications. In this project, the chip was used to create a platform capable of performing computations at speeds up to 8 TeraFLOPS. The chip was also used in the development of a system for medical imaging applications, where it was used to create a system capable of performing high-speed data transfers and image processing.
In terms of precautions, the 10M50DAF672C7G chip should be used with caution when it comes to applications that require high-speed data transfers. It is important to note that the chip should not be used in applications where the data transfer rate exceeds the chip's maximum data rate. Furthermore, the chip should be used with caution when it comes to applications that require a high degree of flexibility, as the chip may not be able to meet the specific requirements of such applications.
Overall, the 10M50DAF672C7G chip is a high-performance and low-power FPGA chip developed by Intel Corporation. It is designed for high-performance computing and digital signal processing applications, and is expected to be in high demand in the near future. The chip is designed to meet a wide range of requirements and is suitable for a variety of applications. It is important to note, however, that the chip should be used with caution when it comes to applications that require high-speed data transfers or a high degree of flexibility.
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2,996 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $69.1488 | $69.1488 |
10+ | $68.4053 | $684.0531 |
100+ | $64.6876 | $6,468.7632 |
1000+ | $60.9700 | $30,484.9760 |
10000+ | $55.7652 | $55,765.2000 |
The price is for reference only, please refer to the actual quotation! |