Intel Corporation
10M40DAF256I6G
10M40DAF256I6G ECAD Model
10M40DAF256I6G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 500 | |
| Number of Outputs | 500 | |
| Number of Logic Cells | 40000 | |
| Number of CLBs | 2500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 2500 CLBS | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
10M40DAF256I6G Datasheet Download
10M40DAF256I6G Overview
The chip model 10M40DAF256I6G is a high-performance digital signal processing chip that uses HDL language. It is suitable for embedded processing, image processing and other applications. The chip is designed to provide users with a powerful, efficient, and reliable platform for their digital signal processing needs.
The chip model 10M40DAF256I6G is an advanced chip that can be used in a variety of applications. It is capable of handling complex tasks such as signal processing, data communication, and image processing. The chip is designed to be efficient, reliable, and powerful, allowing users to utilize the chip in a variety of applications.
In terms of industry trends, the chip model 10M40DAF256I6G is expected to continue to be used in a variety of applications. As new technologies emerge, the chip model 10M40DAF256I6G can be adapted to take advantage of those technologies. The chip is also capable of being upgraded to provide users with more advanced features and capabilities.
The original design intention of the chip model 10M40DAF256I6G is to provide users with a powerful, efficient, and reliable platform for their digital signal processing needs. The chip is designed to be able to handle a variety of tasks and applications, making it a versatile and reliable choice for users. As technology advances, the chip model 10M40DAF256I6G can be upgraded to provide users with more advanced features and capabilities.
The chip model 10M40DAF256I6G can also be applied to advanced communication systems. The chip is designed to be able to handle a variety of tasks and applications, making it a reliable and powerful choice for users. The chip is capable of being upgraded to provide users with more advanced features and capabilities, making it a great choice for those who need a powerful and reliable platform for their communication needs.
In conclusion, the chip model 10M40DAF256I6G is a powerful and reliable chip that can be used in a variety of applications. It is designed to be efficient, reliable, and powerful, allowing users to utilize the chip in a variety of applications. The chip is also capable of being upgraded to provide users with more advanced features and capabilities, making it a great choice for those who need a powerful and reliable platform for their communication needs.
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3,185 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||