Intel Corporation
10M25SCE144A7G
10M25SCE144A7G ECAD Model
10M25SCE144A7G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 3 V | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 25000 | |
| Number of CLBs | 1563 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | AUTOMOTIVE | |
| Package Shape | SQUARE | |
| Organization | 1563 CLBS | |
| Additional Feature | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY | |
| Power Supplies | 3/3.3 V | |
| Supply Voltage-Max | 3.15 V | |
| Supply Voltage-Min | 2.85 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | HQFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.65 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | QFP-144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
10M25SCE144A7G Datasheet Download
10M25SCE144A7G Overview
The chip model 10M25SCE144A7G is a high-performance, low-power integrated circuit designed by a leading semiconductor manufacturer. It is designed to provide reliable, low-power operation in a wide range of communication systems, including cellular, satellite, and wireless networks. This integrated circuit combines a wide range of features, including low-power consumption, high-speed operation, and a range of digital signal processing capabilities.
The chip model 10M25SCE144A7G is designed to meet the demands of today's advanced communication systems. It provides a wide range of features, including high-speed data transmission, low-power consumption, and a range of digital signal processing capabilities. The chip model 10M25SCE144A7G is designed to support the latest communication protocols, such as GSM, CDMA, and UMTS, as well as emerging technologies, such as LTE and 5G.
The chip model 10M25SCE144A7G is designed to be highly reliable and low-power, with a wide range of features to support the most demanding communication systems. The integrated circuit is designed to provide reliable, low-power operation in a wide range of communication systems, including cellular, satellite, and wireless networks. It is designed to support the latest communication protocols, such as GSM, CDMA, and UMTS, as well as emerging technologies, such as LTE and 5G.
The chip model 10M25SCE144A7G is designed to be highly reliable and low-power, with a wide range of features to support the most demanding communication systems. It is designed to optimize performance, power consumption, and system reliability. The chip model 10M25SCE144A7G is designed to be easily upgradable and can be used in a wide range of applications.
The chip model 10M25SCE144A7G is designed to meet the demands of today's advanced communication systems. Its design is based on the latest technologies and standards, and it is designed to be highly reliable and low-power. The chip model 10M25SCE144A7G is designed to be easily upgradable and can be used in a wide range of applications.
When using the chip model 10M25SCE144A7G, it is important to consider the application environment and the specific technologies that are needed. It is also important to consider the original design intention of the chip model 10M25SCE144A7G and the possibility of future upgrades. Additionally, it is important to consider the product description and specific design requirements of the chip model 10M25SCE144A7G, along with actual case studies and precautions.
In conclusion, the chip model 10M25SCE144A7G is a high-performance, low-power integrated circuit designed to meet the demands of today's advanced communication systems. It is designed to provide reliable, low-power operation in a wide range of communication systems, including cellular, satellite, and wireless networks. When using the chip model 10M25SCE144A7G, it is important to consider the application environment and the specific technologies that are needed, as well as the original design intention of the chip model 10M25SCE144A7G and the possibility of future upgrades. Additionally, it is important to consider the product description and specific design requirements of the chip model 10M25SCE144A7G, along with actual case studies and precautions.
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2,029 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $25.0482 | $25.0482 |
| 10+ | $24.7789 | $247.7891 |
| 100+ | $23.4322 | $2,343.2232 |
| 1000+ | $22.0856 | $11,042.7760 |
| 10000+ | $20.2002 | $20,200.2000 |
| The price is for reference only, please refer to the actual quotation! | ||