
Intel Corporation
10M25DCF256C7G
10M25DCF256C7G ECAD Model
10M25DCF256C7G Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 360 | |
Number of Outputs | 360 | |
Number of Logic Cells | 25000 | |
Number of CLBs | 1563 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 1563 CLBS | |
Supply Voltage-Max | 1.25 V | |
Supply Voltage-Min | 1.15 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 1.55 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-256 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10M25DCF256C7G Datasheet Download
10M25DCF256C7G Overview
The chip model 10M25DCF256C7G is a highly advanced digital signal processor (DSP) designed for a variety of applications ranging from high-performance digital signal processing to embedded processing and image processing. It is designed to be used with the HDL language, making it a powerful tool for the development of complex systems.
The 10M25DCF256C7G is an exceptionally powerful chip model, offering a wide range of features and capabilities. It is capable of handling complex tasks such as digital signal processing, image processing, and embedded processing with ease. This chip model is also designed to be highly efficient, delivering superior performance while consuming minimal power. Additionally, the 10M25DCF256C7G is designed with a small form factor, making it ideal for use in space-constrained applications.
The 10M25DCF256C7G's features and capabilities make it an ideal choice for a wide range of industries, from automotive and medical to aerospace and consumer electronics. With its advanced capabilities and efficient design, this chip model is expected to become increasingly popular in the years to come.
In order to make the most of the 10M25DCF256C7G's features and capabilities, it is important to understand the specific design requirements of the chip model. The 10M25DCF256C7G's design requirements include the use of HDL language, the use of a specific DSP architecture, and the use of a specific memory architecture. Additionally, the 10M25DCF256C7G requires specific power and clock management techniques, as well as specific design techniques for optimizing performance.
It is also important to understand the various precautions that should be taken when using the 10M25DCF256C7G. These include avoiding the use of excessive power, avoiding the use of excessive clock frequencies, and avoiding the use of excessive memory sizes. Additionally, it is important to ensure that the chip model is used in accordance with the specific design requirements of the chip model.
To further illustrate the 10M25DCF256C7G's capabilities and design requirements, several case studies have been conducted. These case studies demonstrate the chip model's ability to handle complex tasks, such as digital signal processing, image processing, and embedded processing. Additionally, these case studies provide insight into the design requirements of the chip model, as well as the precautions that should be taken when using the chip model.
The chip model 10M25DCF256C7G is an exceptionally powerful and efficient chip model, offering a wide range of features and capabilities. It is designed to be used with the HDL language, making it a powerful tool for the development of complex systems. With its advanced capabilities and efficient design, this chip model is expected to become increasingly popular in the years to come. In order to make the most of the 10M25DCF256C7G's features and capabilities, it is important to understand the specific design requirements of the chip model, as well as the various precautions that should be taken when using the chip model.
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4,671 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $35.7717 | $35.7717 |
10+ | $35.3871 | $353.8706 |
100+ | $33.4639 | $3,346.3854 |
1000+ | $31.5406 | $15,770.3220 |
10000+ | $28.8482 | $28,848.1500 |
The price is for reference only, please refer to the actual quotation! |