Intel Corporation
10M25DAF256I6G
10M25DAF256I6G ECAD Model
10M25DAF256I6G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 25000 | |
| Number of CLBs | 1563 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 1563 CLBS | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
10M25DAF256I6G Datasheet Download
10M25DAF256I6G Overview
The chip model 10M25DAF256I6G is a high-performance device designed for applications such as digital signal processing, embedded processing, image processing, and more. It is designed to be used with the HDL language, a hardware description language used to design digital circuits and systems. This makes it suitable for a variety of applications and industries.
In terms of industry trends, the chip model 10M25DAF256I6G is likely to be used in more complex applications as technology advances. As new technologies become available, the chip model 10M25DAF256I6G is likely to be used in more applications, such as networks and intelligent systems. This could mean that the chip model 10M25DAF256I6G could be used in fully intelligent systems in the future.
The chip model 10M25DAF256I6G is an excellent choice for applications that require high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, making it suitable for a variety of applications and industries. As new technologies become available, the chip model 10M25DAF256I6G is likely to be used in more complex applications and could even be used in fully intelligent systems in the future. With its high-performance capabilities, the chip model 10M25DAF256I6G is sure to be a valuable asset in the years to come.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||