10M16DCF256I6G
10M16DCF256I6G
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rohs

Intel Corporation

10M16DCF256I6G


10M16DCF256I6G
F18-10M16DCF256I6G
Active
FIELD PROGRAMMABLE GATE ARRAY, FBGA-256
FBGA-256

10M16DCF256I6G ECAD Model


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10M16DCF256I6G Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 320
Number of Outputs 320
Number of Logic Cells 16000
Number of CLBs 1000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Organization 1000 CLBS
Supply Voltage-Max 1.25 V
Supply Voltage-Min 1.15 V
JESD-30 Code S-PBGA-B256
JESD-609 Code e1
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 1.55 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-256
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10M16DCF256I6G Datasheet Download


10M16DCF256I6G Overview



The chip model 10M16DCF256I6G is a high-performance integrated circuit designed for use in digital signal processing, embedded processing, and image processing applications. It is a powerful and efficient solution for many of these tasks, as it utilizes the HDL (Hardware Description Language) for programming. This allows for a more efficient programming process than traditional software languages, as the HDL is designed specifically for hardware development.


The 10M16DCF256I6G chip model offers many advantages over other chip models. It has a low power consumption and is capable of providing high performance while still being cost-effective. Additionally, it has a wide range of features and functions, allowing for greater flexibility and customization in its applications. These features include a wide range of input and output options, as well as a variety of memory and peripheral interfaces.


The expected demand for the 10M16DCF256I6G chip model in related industries is likely to increase significantly in the future. This is due to the increasing demand for high-performance and cost-effective solutions in many areas, such as digital signal processing, embedded processing, and image processing. As these industries continue to grow, the 10M16DCF256I6G chip model will become increasingly popular and widely used.


The original design intention of the 10M16DCF256I6G chip model was to provide an efficient and cost-effective solution for digital signal processing, embedded processing, and image processing applications. It is designed to be flexible and customizable, allowing for a wide range of features and functions to be implemented. Additionally, it is capable of being upgraded in the future, allowing for the addition of new features and functions. This makes it an ideal solution for many applications and industries.


The 10M16DCF256I6G chip model is also capable of being used in advanced communication systems. This is due to its wide range of features and functions, as well as its ability to be upgraded in the future. This makes it a suitable solution for many communication systems, as it can be adapted to meet the specific needs of each system. Additionally, its low power consumption and cost-effectiveness make it an attractive solution for many communication systems.


In conclusion, the 10M16DCF256I6G chip model is a powerful and efficient solution for many digital signal processing, embedded processing, and image processing applications. It utilizes the HDL for programming, allowing for a more efficient programming process than traditional software languages. Additionally, it has a wide range of features and functions, making it suitable for many applications and industries. Finally, its low power consumption and cost-effectiveness make it an attractive solution for many communication systems.



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