Intel Corporation
10M16DAF484I6G
10M16DAF484I6G ECAD Model
10M16DAF484I6G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 320 | |
| Number of Outputs | 320 | |
| Number of Logic Cells | 16000 | |
| Number of CLBs | 1000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 1000 CLBS | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B484 | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-484 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10M16DAF484I6G Datasheet Download
10M16DAF484I6G Overview
The chip model 10M16DAF484I6G is a product of the semiconductor industry, which is a rapidly developing field of technology. It is a highly complex device that is capable of performing a variety of tasks, from basic computing to advanced communication. The chip model 10M16DAF484I6G is designed to be able to support a wide range of applications, from basic data processing to advanced communication systems.
The industry trends of the chip model 10M16DAF484I6G are constantly evolving as new technologies emerge. For example, the chip model 10M16DAF484I6G is designed to be able to support the latest technologies such as 5G and Wi-Fi 6. This is beneficial for the chip model 10M16DAF484I6G as it allows it to remain competitive in the market and be able to support the latest technologies.
The original design intention of the chip model 10M16DAF484I6G is to provide a platform for advanced communication systems. It is designed to be able to support a wide range of communication protocols, from basic data processing to advanced data transmission. This allows the chip model 10M16DAF484I6G to be used in a variety of applications, from basic data processing to advanced communication systems.
The future development of related industries and the need for new technologies to support the application environment is an important factor in the future of the chip model 10M16DAF484I6G. New technologies such as 5G and Wi-Fi 6 are essential for the chip model 10M16DAF484I6G to remain competitive in the market and be able to support the latest technologies.
The possible future applications of the chip model 10M16DAF484I6G in networks and which intelligent scenarios it may be applied to are also important factors in the future of the chip model 10M16DAF484I6G. The chip model 10M16DAF484I6G is designed to be able to support a wide range of networks and intelligent scenarios, from basic data processing to advanced communication systems. This allows the chip model 10M16DAF484I6G to be used in a variety of applications, from basic data processing to advanced communication systems.
The chip model 10M16DAF484I6G is also designed to be able to support the latest technologies such as 5G and Wi-Fi 6. This is beneficial for the chip model 10M16DAF484I6G as it allows it to remain competitive in the market and be able to support the latest technologies. The chip model 10M16DAF484I6G is also designed to be able to support the latest technologies such as artificial intelligence and machine learning, which are essential for the chip model 10M16DAF484I6G to be used in the era of fully intelligent systems.
In conclusion, the chip model 10M16DAF484I6G is a highly complex device that is capable of performing a variety of tasks, from basic computing to advanced communication. It is designed to be able to support a wide range of applications, from basic data processing to advanced communication systems. The industry trends of the chip model 10M16DAF484I6G are constantly evolving as new technologies emerge, and the chip model 10M16DAF484I6G is designed to be able to support the latest technologies such as 5G and Wi-Fi 6. The chip model 10M16DAF484I6G is also designed to be able to support the latest technologies such as artificial intelligence and machine learning, which are essential for the chip model 10M16DAF484I6G to be used in the era of fully intelligent systems.
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5,600 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||