Intel Corporation
10M16DAF256C7G
10M16DAF256C7G ECAD Model
10M16DAF256C7G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 320 | |
| Number of Outputs | 320 | |
| Number of Logic Cells | 16000 | |
| Number of CLBs | 1000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 1000 CLBS | |
| Power Supplies | 1.2 V | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10M16DAF256C7G Datasheet Download
10M16DAF256C7G Overview
The chip model 10M16DAF256C7G is a high-performance device designed for digital signal processing, embedded processing, and image processing. It uses the HDL language, which is a high-level hardware description language, to describe the logic of digital systems. This chip model is designed to provide high-performance solutions for digital signal processing, embedded processing, and image processing.
The 10M16DAF256C7G chip model has a number of advantages, including improved performance, lower power consumption, and smaller size. In addition, this chip model is designed to be compatible with a wide range of embedded applications, such as in industrial and automotive systems. This chip model is also designed to be flexible and scalable, allowing for future upgrades and expansions.
The 10M16DAF256C7G chip model is expected to become increasingly popular in the future, as the demand for high-performance digital signal processing, embedded processing, and image processing solutions grows. This chip model is designed to provide solutions for a wide range of applications, from high-end industrial applications to automotive systems. As the demand for these applications increases, the 10M16DAF256C7G chip model is expected to become increasingly popular.
The original design intention of the 10M16DAF256C7G chip model was to provide a high-performance solution for digital signal processing, embedded processing, and image processing. This chip model is designed to be compatible with a wide range of embedded applications, and can be used in a wide range of advanced communication systems. In addition, this chip model is designed to be flexible and scalable, allowing for future upgrades and expansions. This flexibility and scalability make the 10M16DAF256C7G chip model a great option for those looking for a high-performance solution for their digital signal processing, embedded processing, and image processing needs.
You May Also Be Interested In
5,128 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,648.3626 | $2,648.3626 |
| 10+ | $2,619.8856 | $26,198.8556 |
| 100+ | $2,477.5005 | $247,750.0479 |
| 1000+ | $2,335.1154 | $1,167,557.6970 |
| 10000+ | $2,135.7763 | $2,135,776.2750 |
| The price is for reference only, please refer to the actual quotation! | ||