Intel Corporation
10M04DCU324I7P
10M04DCU324I7P ECAD Model
10M04DCU324I7P Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 246 | |
| Number of Outputs | 246 | |
| Number of Logic Cells | 4000 | |
| Number of CLBs | 250 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 250 CLBS | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA324,18X18,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm | |
| Length | 15 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | UBGA-324 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10M04DCU324I7P Datasheet Download
10M04DCU324I7P Overview
The 10M04DCU324I7P chip model is a powerful and versatile model designed for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is a powerful tool for engineers and developers to create innovative products and solutions.
The original design intention of the chip model 10M04DCU324I7P was to provide a robust and reliable platform for high-performance applications. It is capable of delivering high-performance computing and data processing capabilities and has the potential to be upgraded in the future. This makes it an ideal option for advanced communication systems, such as 5G and beyond.
The 10M04DCU324I7P chip model is also suitable for the development and popularization of future intelligent robots. It provides a reliable platform for the development of sophisticated robotic systems. To effectively use the model, engineers and developers need to have a good understanding of the HDL language and the capabilities of the chip model. Additionally, they need to have a good understanding of robotics, artificial intelligence, and other related technologies.
In conclusion, the 10M04DCU324I7P chip model is a powerful and versatile model designed for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is an ideal option for advanced communication systems and for the development and popularization of future intelligent robots. To effectively use the model, engineers and developers need to have a good understanding of the HDL language and the capabilities of the chip model, as well as a good understanding of robotics, artificial intelligence, and other related technologies.
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2,490 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $46.1317 | $46.1317 |
| 10+ | $45.6357 | $456.3568 |
| 100+ | $43.1555 | $4,315.5480 |
| 1000+ | $40.6753 | $20,337.6400 |
| 10000+ | $37.2030 | $37,203.0000 |
| The price is for reference only, please refer to the actual quotation! | ||