Intel Corporation
10CX105YF672I6G
10CX105YF672I6G ECAD Model
10CX105YF672I6G Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 236 | |
| Number of Outputs | 236 | |
| Number of Logic Cells | 104000 | |
| Number of CLBs | 38000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 38000 CLBS | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B672 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-672 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10CX105YF672I6G Datasheet Download
10CX105YF672I6G Overview
The chip model 10CX105YF672I6G is a powerful and versatile digital signal processor (DSP) that is suitable for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. This chip model is programmed using HDL, which is a hardware description language that allows for the design and implementation of complex digital systems.
The 10CX105YF672I6G chip model has many advantages over other models. It is designed with a high-performance processor core and a wide range of peripheral components, making it suitable for a variety of tasks. In addition, this chip model has a low power consumption, making it more energy efficient than other models. Furthermore, it has a high degree of scalability, meaning that it can be easily upgraded to meet more advanced requirements.
The 10CX105YF672I6G chip model is expected to be in high demand in the near future. With its wide range of features and benefits, it is ideal for applications such as image processing, embedded processing, and digital signal processing. Furthermore, its scalability makes it a great choice for future upgrades, allowing it to be used for more advanced applications.
The 10CX105YF672I6G chip model was originally designed with the intention to provide a powerful and versatile DSP that can be used for a wide range of applications. It has the potential to be upgraded to meet more advanced requirements, and it can be used for advanced communication systems if necessary. Furthermore, its scalability makes it an ideal choice for those looking to upgrade their systems in the future.
In conclusion, the 10CX105YF672I6G chip model is a powerful and versatile DSP that is suitable for high-performance digital signal processing, embedded processing, image processing, and more. It is designed with a high-performance processor core and a wide range of peripheral components, making it suitable for a variety of tasks. Furthermore, its scalability makes it a great choice for future upgrades, allowing it to be used for more advanced applications. With its wide range of features and benefits, the 10CX105YF672I6G chip model is expected to be in high demand in the near future.
You May Also Be Interested In
3,150 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $100.5819 | $100.5819 |
| 10+ | $99.5004 | $995.0039 |
| 100+ | $94.0928 | $9,409.2762 |
| 1000+ | $88.6851 | $44,342.5660 |
| 10000+ | $81.1145 | $81,114.4500 |
| The price is for reference only, please refer to the actual quotation! | ||