Intel Corporation
10AX115U4F45I3SG
10AX115U4F45I3SG ECAD Model
10AX115U4F45I3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 480 | |
| Number of Outputs | 480 | |
| Number of Logic Cells | 1150000 | |
| Number of CLBs | 42720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 42720 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1932 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1932 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115U4F45I3SG Datasheet Download
10AX115U4F45I3SG Overview
The chip model 10AX115U4F45I3SG is a powerful and versatile processor that is suitable for a range of applications, including high-performance digital signal processing, embedded processing, and image processing. The chip model was designed with the intention of providing a reliable and efficient platform for these applications, and the ability to use HDL language further enhances its capabilities.
The industry trends for the chip model 10AX115U4F45I3SG and related industries are constantly changing, and to remain competitive, the application environment must be able to keep up with the latest technologies. This could involve the implementation of new technologies such as artificial intelligence or machine learning, or the integration of existing technologies such as 5G or IoT.
The chip model 10AX115U4F45I3SG is also capable of being upgraded in the future to add new features or improve existing ones. This could be done by adding additional hardware components or by using software updates. The chip model can also be applied to advanced communication systems, such as those used in autonomous vehicles or industrial automation.
Overall, the chip model 10AX115U4F45I3SG is a powerful and reliable processor, and its versatile design makes it suitable for a range of applications. Its ability to be upgraded and applied to advanced communication systems means that it can keep up with the latest industry trends and remain competitive in the future.
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3,599 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $23,457.4804 | $23,457.4804 |
| 10+ | $23,205.2494 | $232,052.4942 |
| 100+ | $21,944.0946 | $2,194,409.4564 |
| 1000+ | $20,682.9397 | $10,341,469.8520 |
| 10000+ | $18,917.3229 | $18,917,322.9000 |
| The price is for reference only, please refer to the actual quotation! | ||