
Intel Corporation
10AX115U4F45E3SG
10AX115U4F45E3SG ECAD Model
10AX115U4F45E3SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 480 | |
Number of Outputs | 480 | |
Number of Logic Cells | 1150000 | |
Number of CLBs | 42720 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 42720 CLBS | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1932 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1932 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1932,44X44,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1932,44X44,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX115U4F45E3SG Datasheet Download
10AX115U4F45E3SG Overview
The chip model 10AX115U4F45E3SG is a powerful computing solution designed to meet the increasing demands of modern computing applications. It is a high-performance digital signal processing (DSP) chip, an embedded processing chip, and an image processing chip. It is designed to be used with the HDL (Hardware Description Language) language to make it easier for users to program and control the chip.
The original design intention of the chip model 10AX115U4F45E3SG was to provide a powerful and reliable computing solution for a variety of applications. It has the ability to process data quickly and accurately, and can be used for a variety of tasks, from simple calculations to complex algorithms. It also has the potential to be upgraded in the future, allowing users to take advantage of new features and capabilities as they become available.
The chip model 10AX115U4F45E3SG can also be applied to the development and popularization of future intelligent robots. As robots become increasingly capable and intelligent, the need for powerful and reliable computing solutions will increase. The chip model 10AX115U4F45E3SG can provide the necessary computing power to enable robots to perform complex tasks such as object recognition, navigation, and decision-making.
In order to use the chip model 10AX115U4F45E3SG effectively, users need to be familiar with the HDL language. They must also have a strong understanding of the underlying hardware and software architecture of the chip, as well as the associated programming tools. Additionally, users should have a good understanding of the application scenarios in which the chip model 10AX115U4F45E3SG can be used, as well as the potential for future upgrades. By having a comprehensive understanding of the chip model 10AX115U4F45E3SG and its capabilities, users can maximize its potential and effectively use it to develop and popularize future intelligent robots.
You May Also Be Interested In
2,022 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $4,476.6604 | $4,476.6604 |
10+ | $4,428.5242 | $44,285.2424 |
100+ | $4,187.8436 | $418,784.3571 |
1000+ | $3,947.1629 | $1,973,581.4530 |
10000+ | $3,610.2100 | $3,610,209.9750 |
The price is for reference only, please refer to the actual quotation! |