10AX115U3F45E2SG
10AX115U3F45E2SG
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rohs

Intel Corporation

10AX115U3F45E2SG


10AX115U3F45E2SG
F18-10AX115U3F45E2SG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1932,44X44,40
BGA, BGA1932,44X44,40

10AX115U3F45E2SG ECAD Model


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10AX115U3F45E2SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 480
Number of Outputs 480
Number of Logic Cells 1150000
Number of CLBs 42720
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 42720 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1932
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1932
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1932,44X44,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 45 mm
Length 45 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1932,44X44,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX115U3F45E2SG Datasheet Download


10AX115U3F45E2SG Overview



The chip model 10AX115U3F45E2SG is a high-performance, low-power, and cost-effective system-on-chip (SoC) designed to meet the needs of a wide range of applications. It is designed to provide high-performance computing, networking, and connectivity solutions for advanced applications. It is based on a high-performance 64-bit ARM Cortex-A72 processor, and is equipped with advanced features such as a high-performance graphics processing unit (GPU) and a high-bandwidth memory controller.


The 10AX115U3F45E2SG chip model is ideal for next-generation applications that require high-performance computing, networking, and connectivity solutions. It is suitable for a variety of applications such as 5G networks, artificial intelligence, autonomous driving, and edge computing. With its powerful performance and low power consumption, the chip model is ideal for embedded systems, industrial automation, and other applications that require high performance and low power consumption.


In terms of industry trends, the 10AX115U3F45E2SG chip model is expected to be widely used in the near future. With the development of 5G networks, artificial intelligence, and autonomous driving, the chip model will be increasingly applied in these fields. In addition, the chip model is expected to be used in the era of fully intelligent systems, where it can provide the necessary computing power and connectivity for autonomous systems.


Regarding its application environment, the 10AX115U3F45E2SG chip model is designed to support a wide range of technologies. It supports advanced technologies such as deep learning, machine learning, and computer vision, as well as the latest 5G networks and other wireless technologies. In addition, the chip model also supports a wide range of operating systems, including Linux and Android, and provides support for the latest version of the ARM Cortex-A72 processor.


The product description and specific design requirements of the 10AX115U3F45E2SG chip model include features such as its high-performance GPU and high-bandwidth memory controller. It is designed to support a wide range of technologies, including 5G networks, artificial intelligence, and autonomous driving. In addition, the chip model is designed to be power efficient, with a low power consumption of 6.5W. It is also designed to be highly reliable, with a maximum operating temperature of 85°C.


To ensure the successful implementation of the 10AX115U3F45E2SG chip model, there are a few precautions that must be taken. First, the chip model must be properly cooled, as it is designed to operate at a temperature of 85°C. Second, the chip model must be properly configured to ensure optimal performance. Third, the chip model must be tested thoroughly to ensure that it meets the required performance and reliability standards.


In conclusion, the 10AX115U3F45E2SG chip model is a high-performance and low-power system-on-chip designed to meet the needs of a wide range of applications. It is expected to be widely used in the near future, and is designed to support a wide range of technologies including 5G networks, artificial intelligence, and autonomous driving. Furthermore, the product description and specific design requirements, as well as precautions, must be taken into consideration in order to ensure the successful implementation of the chip model.



2,437 In Stock


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Unit Price: $6,353.6376
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $5,908.8830 $5,908.8830
10+ $5,845.3466 $58,453.4659
100+ $5,527.6647 $552,766.4712
1000+ $5,209.9828 $2,604,991.4160
10000+ $4,765.2282 $4,765,228.2000
The price is for reference only, please refer to the actual quotation!

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