
Intel Corporation
10AX115U3F45E2SG
10AX115U3F45E2SG ECAD Model
10AX115U3F45E2SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 480 | |
Number of Outputs | 480 | |
Number of Logic Cells | 1150000 | |
Number of CLBs | 42720 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 42720 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1932 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1932 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1932,44X44,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1932,44X44,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX115U3F45E2SG Datasheet Download
10AX115U3F45E2SG Overview
The chip model 10AX115U3F45E2SG is a high-performance, low-power, and cost-effective system-on-chip (SoC) designed to meet the needs of a wide range of applications. It is designed to provide high-performance computing, networking, and connectivity solutions for advanced applications. It is based on a high-performance 64-bit ARM Cortex-A72 processor, and is equipped with advanced features such as a high-performance graphics processing unit (GPU) and a high-bandwidth memory controller.
The 10AX115U3F45E2SG chip model is ideal for next-generation applications that require high-performance computing, networking, and connectivity solutions. It is suitable for a variety of applications such as 5G networks, artificial intelligence, autonomous driving, and edge computing. With its powerful performance and low power consumption, the chip model is ideal for embedded systems, industrial automation, and other applications that require high performance and low power consumption.
In terms of industry trends, the 10AX115U3F45E2SG chip model is expected to be widely used in the near future. With the development of 5G networks, artificial intelligence, and autonomous driving, the chip model will be increasingly applied in these fields. In addition, the chip model is expected to be used in the era of fully intelligent systems, where it can provide the necessary computing power and connectivity for autonomous systems.
Regarding its application environment, the 10AX115U3F45E2SG chip model is designed to support a wide range of technologies. It supports advanced technologies such as deep learning, machine learning, and computer vision, as well as the latest 5G networks and other wireless technologies. In addition, the chip model also supports a wide range of operating systems, including Linux and Android, and provides support for the latest version of the ARM Cortex-A72 processor.
The product description and specific design requirements of the 10AX115U3F45E2SG chip model include features such as its high-performance GPU and high-bandwidth memory controller. It is designed to support a wide range of technologies, including 5G networks, artificial intelligence, and autonomous driving. In addition, the chip model is designed to be power efficient, with a low power consumption of 6.5W. It is also designed to be highly reliable, with a maximum operating temperature of 85°C.
To ensure the successful implementation of the 10AX115U3F45E2SG chip model, there are a few precautions that must be taken. First, the chip model must be properly cooled, as it is designed to operate at a temperature of 85°C. Second, the chip model must be properly configured to ensure optimal performance. Third, the chip model must be tested thoroughly to ensure that it meets the required performance and reliability standards.
In conclusion, the 10AX115U3F45E2SG chip model is a high-performance and low-power system-on-chip designed to meet the needs of a wide range of applications. It is expected to be widely used in the near future, and is designed to support a wide range of technologies including 5G networks, artificial intelligence, and autonomous driving. Furthermore, the product description and specific design requirements, as well as precautions, must be taken into consideration in order to ensure the successful implementation of the chip model.
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2,437 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $5,908.8830 | $5,908.8830 |
10+ | $5,845.3466 | $58,453.4659 |
100+ | $5,527.6647 | $552,766.4712 |
1000+ | $5,209.9828 | $2,604,991.4160 |
10000+ | $4,765.2282 | $4,765,228.2000 |
The price is for reference only, please refer to the actual quotation! |