Intel Corporation
10AX115U3F45E2LG
10AX115U3F45E2LG ECAD Model
10AX115U3F45E2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 480 | |
| Number of Outputs | 480 | |
| Number of Logic Cells | 1150000 | |
| Number of CLBs | 42720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 42720 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1932 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1932 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115U3F45E2LG Datasheet Download
10AX115U3F45E2LG Overview
The chip model 10AX115U3F45E2LG is a high-performance integrated circuit designed for digital signal processing, embedded processing, and image processing. It is based on the HDL language, which is used to create high-level hardware designs. This chip is capable of processing large amounts of data quickly, making it ideal for applications that require high-performance computing.
The original design intention of the chip model 10AX115U3F45E2LG was to provide a powerful, yet affordable, solution for digital signal processing, embedded processing, and image processing. This chip has a wide range of applications, from consumer electronics to industrial automation. It is also capable of being upgraded to meet the needs of more advanced applications.
The chip model 10AX115U3F45E2LG is also capable of being applied to advanced communication systems. This chip has the ability to process large amounts of data quickly, making it ideal for applications in networks. It can be used in intelligent scenarios such as facial recognition, object tracking, and other machine learning tasks. In addition, this chip is capable of being used in the era of fully intelligent systems, such as autonomous vehicles.
The chip model 10AX115U3F45E2LG is a powerful, yet affordable, solution for digital signal processing, embedded processing, and image processing. It is based on the HDL language, which allows for high-level hardware designs. This chip is capable of processing large amounts of data quickly, making it ideal for applications that require high-performance computing. It is also capable of being applied to advanced communication systems and intelligent scenarios, making it a great choice for the era of fully intelligent systems.
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3,167 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $32,255.6327 | $32,255.6327 |
| 10+ | $31,908.7979 | $319,087.9792 |
| 100+ | $30,174.6241 | $3,017,462.4120 |
| 1000+ | $28,440.4503 | $14,220,225.1600 |
| 10000+ | $26,012.6070 | $26,012,607.0000 |
| The price is for reference only, please refer to the actual quotation! | ||