Intel Corporation
10AX115U2F45I2SG
10AX115U2F45I2SG ECAD Model
10AX115U2F45I2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 480 | |
| Number of Outputs | 480 | |
| Number of Logic Cells | 1150000 | |
| Number of CLBs | 42720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 42720 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1932 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1932 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115U2F45I2SG Datasheet Download
10AX115U2F45I2SG Overview
The chip model 10AX115U2F45I2SG is a multi-core processor designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with a high-level hardware description language (HDL) and provides a range of features to support efficient and effective system development. The original design intention of the chip model 10AX115U2F45I2SG was to provide a powerful and reliable platform for advanced applications that require complex processing and data management.
The chip model 10AX115U2F45I2SG is capable of being upgraded to support more advanced applications. This includes the possibility of being applied to advanced communication systems, such as networks and wireless communication. The chip model 10AX115U2F45I2SG can also be used to support intelligent scenarios, such as machine learning and artificial intelligence. The chip model 10AX115U2F45I2SG is a highly versatile platform that can be used in a variety of applications, and its capability can be further enhanced with additional upgrades.
The chip model 10AX115U2F45I2SG has the potential to be used in the future of fully intelligent systems. Its ability to process data quickly and accurately makes it an ideal platform for the development of intelligent systems. Its ability to support multiple cores and its support for high-level hardware description language (HDL) make it a powerful platform for the development of intelligent systems. Furthermore, its low power consumption and its ability to be upgraded make it a highly efficient platform for the development of intelligent systems.
The chip model 10AX115U2F45I2SG is a powerful and versatile platform for the development of advanced applications. Its ability to be upgraded and its support for high-level hardware description language (HDL) make it an ideal platform for the development of advanced communication systems, intelligent scenarios, and fully intelligent systems. Its low power consumption and its ability to be upgraded make it a highly efficient platform for the development of advanced applications.
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1,411 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $37,540.9993 | $37,540.9993 |
| 10+ | $37,137.3326 | $371,373.3263 |
| 100+ | $35,118.9993 | $3,511,899.9333 |
| 1000+ | $33,100.6660 | $16,550,333.0190 |
| 10000+ | $30,274.9994 | $30,274,999.4250 |
| The price is for reference only, please refer to the actual quotation! | ||