10AX115S4F45I3SG
10AX115S4F45I3SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX115S4F45I3SG


10AX115S4F45I3SG
F18-10AX115S4F45I3SG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1932,44X44,40
BGA, BGA1932,44X44,40

10AX115S4F45I3SG ECAD Model


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10AX115S4F45I3SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 624
Number of Outputs 624
Number of Logic Cells 1150000
Number of CLBs 42720
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology TSMC
Organization 42720 CLBS
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1932
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1932
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1932,44X44,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 45 mm
Length 45 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1932,44X44,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX115S4F45I3SG Datasheet Download


10AX115S4F45I3SG Overview



The chip model 10AX115S4F45I3SG is a new type of high-performance chip designed for digital signal processing, embedded processing, and image processing. It is designed to meet the increasing demand for high-performance chips in the industry. The chip is designed with a high-performance architecture and is capable of performing complex operations quickly and accurately.


The chip model 10AX115S4F45I3SG is built on a 45-nanometer process and has an integrated logic core and memory. It has an integrated memory controller, which allows for faster data access, and a high-speed bus interface. The chip also has a low-power design, which makes it ideal for embedded applications. It is also designed for use with HDL (Hardware Description Language) for efficient design and implementation.


The chip model 10AX115S4F45I3SG offers several advantages over other chips in its class. It is capable of performing complex operations quickly and accurately, and it has a low-power design that allows it to be used in embedded applications. It also has a high-speed bus interface and an integrated memory controller, which allows for faster data access. Additionally, the chip is designed for use with HDL, which allows for efficient design and implementation.


The chip model 10AX115S4F45I3SG is expected to be in high demand in the coming years due to its high performance and low power consumption. It is ideal for a variety of applications, including digital signal processing, embedded processing, and image processing. With its high-performance architecture and low-power design, it is well suited for use in a wide range of devices and applications.


In order to properly design and implement the chip model 10AX115S4F45I3SG, it is important to understand the product description and specific design requirements. The product description should include information about the chip's architecture, features, and capabilities. Additionally, the specific design requirements should include information about the chip's power consumption, memory size, and the HDL language used.


When designing and implementing the chip model 10AX115S4F45I3SG, it is important to take into account actual case studies and precautions. For example, it is important to consider the power consumption of the chip, as well as the design of the HDL language used. Additionally, it is important to consider the size of the memory and the speed of the bus interface.


In conclusion, the chip model 10AX115S4F45I3SG is a high-performance chip that is ideal for digital signal processing, embedded processing, and image processing. It is designed with a high-performance architecture and is capable of performing complex operations quickly and accurately. It has a low-power design, which makes it ideal for embedded applications, and it is designed for use with HDL for efficient design and implementation. The chip model 10AX115S4F45I3SG is expected to be in high demand in the coming years due to its high performance and low power consumption. It is important to understand the product description and specific design requirements, as well as take into account actual case studies and precautions when designing and implementing the chip model 10AX115S4F45I3SG.



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Unit Price: $25,612.0064
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Pricing (USD)

QTY Unit Price Ext Price
1+ $23,819.1660 $23,819.1660
10+ $23,563.0459 $235,630.4589
100+ $22,282.4456 $2,228,244.5568
1000+ $21,001.8452 $10,500,922.6240
10000+ $19,209.0048 $19,209,004.8000
The price is for reference only, please refer to the actual quotation!

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