
Intel Corporation
10AX115S4F45I3SG
10AX115S4F45I3SG ECAD Model
10AX115S4F45I3SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 624 | |
Number of Outputs | 624 | |
Number of Logic Cells | 1150000 | |
Number of CLBs | 42720 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 42720 CLBS | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1932 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1932 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1932,44X44,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1932,44X44,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX115S4F45I3SG Datasheet Download
10AX115S4F45I3SG Overview
The chip model 10AX115S4F45I3SG is a new type of high-performance chip designed for digital signal processing, embedded processing, and image processing. It is designed to meet the increasing demand for high-performance chips in the industry. The chip is designed with a high-performance architecture and is capable of performing complex operations quickly and accurately.
The chip model 10AX115S4F45I3SG is built on a 45-nanometer process and has an integrated logic core and memory. It has an integrated memory controller, which allows for faster data access, and a high-speed bus interface. The chip also has a low-power design, which makes it ideal for embedded applications. It is also designed for use with HDL (Hardware Description Language) for efficient design and implementation.
The chip model 10AX115S4F45I3SG offers several advantages over other chips in its class. It is capable of performing complex operations quickly and accurately, and it has a low-power design that allows it to be used in embedded applications. It also has a high-speed bus interface and an integrated memory controller, which allows for faster data access. Additionally, the chip is designed for use with HDL, which allows for efficient design and implementation.
The chip model 10AX115S4F45I3SG is expected to be in high demand in the coming years due to its high performance and low power consumption. It is ideal for a variety of applications, including digital signal processing, embedded processing, and image processing. With its high-performance architecture and low-power design, it is well suited for use in a wide range of devices and applications.
In order to properly design and implement the chip model 10AX115S4F45I3SG, it is important to understand the product description and specific design requirements. The product description should include information about the chip's architecture, features, and capabilities. Additionally, the specific design requirements should include information about the chip's power consumption, memory size, and the HDL language used.
When designing and implementing the chip model 10AX115S4F45I3SG, it is important to take into account actual case studies and precautions. For example, it is important to consider the power consumption of the chip, as well as the design of the HDL language used. Additionally, it is important to consider the size of the memory and the speed of the bus interface.
In conclusion, the chip model 10AX115S4F45I3SG is a high-performance chip that is ideal for digital signal processing, embedded processing, and image processing. It is designed with a high-performance architecture and is capable of performing complex operations quickly and accurately. It has a low-power design, which makes it ideal for embedded applications, and it is designed for use with HDL for efficient design and implementation. The chip model 10AX115S4F45I3SG is expected to be in high demand in the coming years due to its high performance and low power consumption. It is important to understand the product description and specific design requirements, as well as take into account actual case studies and precautions when designing and implementing the chip model 10AX115S4F45I3SG.
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1,383 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $23,819.1660 | $23,819.1660 |
10+ | $23,563.0459 | $235,630.4589 |
100+ | $22,282.4456 | $2,228,244.5568 |
1000+ | $21,001.8452 | $10,500,922.6240 |
10000+ | $19,209.0048 | $19,209,004.8000 |
The price is for reference only, please refer to the actual quotation! |