Intel Corporation
10AX115S4F45E3SG
10AX115S4F45E3SG ECAD Model
10AX115S4F45E3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 624 | |
| Number of Outputs | 624 | |
| Number of Logic Cells | 1150000 | |
| Number of CLBs | 42720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 42720 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1932 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1932 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115S4F45E3SG Datasheet Download
10AX115S4F45E3SG Overview
The chip model 10AX115S4F45E3SG is the latest development from a leading chip manufacturer in the industry. It is designed to be a powerful, yet energy-efficient, processor for a wide range of applications. The chip is designed to be versatile and can be used in a variety of settings, from advanced communication systems to intelligent robots.
The original design intention of the chip model 10AX115S4F45E3SG was to create a powerful processor that could be used in a wide range of applications. It is designed to be energy efficient and powerful, making it an ideal choice for a variety of applications. The chip is capable of handling a wide range of tasks, from basic computing tasks to more complex tasks such as artificial intelligence and machine learning.
The chip model 10AX115S4F45E3SG is also capable of being used in advanced communication systems. It is capable of providing high-speed data transmission and can be used to create a reliable network infrastructure. It is also capable of being used in the era of fully intelligent systems, as it is capable of handling complex tasks such as artificial intelligence and machine learning.
The chip model 10AX115S4F45E3SG can also be used in the development and popularization of future intelligent robots. It is capable of providing a powerful and energy-efficient processor that can be used to create robots that can learn and respond to their environment. In order to use the chip model effectively, it is important to have technical talents that are familiar with the chip and its capabilities.
In conclusion, the chip model 10AX115S4F45E3SG is a powerful and energy-efficient processor that can be used in a variety of applications. It is capable of being used in advanced communication systems, as well as in the development and popularization of future intelligent robots. In order to use the chip model effectively, it is important to have technical talents that are familiar with the chip and its capabilities.
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3,675 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $17,365.7213 | $17,365.7213 |
| 10+ | $17,178.9931 | $171,789.9311 |
| 100+ | $16,245.3522 | $1,624,535.2182 |
| 1000+ | $15,311.7113 | $7,655,855.6260 |
| 10000+ | $14,004.6140 | $14,004,613.9500 |
| The price is for reference only, please refer to the actual quotation! | ||