Intel Corporation
10AX115S4F45E3LG
10AX115S4F45E3LG ECAD Model
10AX115S4F45E3LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 624 | |
| Number of Outputs | 624 | |
| Number of Logic Cells | 1150000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1932 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1932 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.65 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115S4F45E3LG Overview
Chip model 10AX115S4F45E3LG is a new generation of integrated circuit, developed by the leading technology company, XYZ. It is the latest in a series of semiconductor products that have been created to power the latest generation of electronic devices. This chip model is equipped with a variety of features and functions, including high-speed data transfer, low power consumption, and a wide range of applications.
The industry trends of the chip model 10AX115S4F45E3LG are focused on providing reliable, high-performance solutions for the ever-evolving technology landscape. As the demand for faster, more reliable, and more efficient technology increases, the chip model 10AX115S4F45E3LG is designed to meet those needs. It is designed to provide the ultimate in performance and reliability, while also reducing power consumption.
The original design intention of the chip model 10AX115S4F45E3LG is to provide the highest level of performance and reliability for the latest generation of electronic devices. The chip model is designed to provide the highest level of performance and reliability, while also reducing power consumption. This chip model is designed to be used in a wide range of applications, including advanced communication systems, and can be used in the development and popularization of future intelligent robots.
In terms of future development of the chip model 10AX115S4F45E3LG, the focus is on providing the highest level of performance and reliability while also reducing power consumption. The chip model is designed to be used in a wide range of applications, and can be used in the development and popularization of future intelligent robots. The chip model is designed to provide the ultimate in performance and reliability, while also reducing power consumption.
The application environment of the chip model 10AX115S4F45E3LG requires the support of new technologies. The chip model is designed to be used in a wide range of applications, and requires the support of new technologies to meet the demands of the ever-evolving technology landscape. In order to use the chip model effectively, technical talents with expertise in the latest technologies are needed.
In conclusion, the chip model 10AX115S4F45E3LG is a new generation of integrated circuit, designed to provide the highest level of performance and reliability while also reducing power consumption. The chip model is designed to be used in a wide range of applications, including advanced communication systems, and can be used in the development and popularization of future intelligent robots. In order to use the chip model effectively, technical talents with expertise in the latest technologies are needed. The industry trends of the chip model 10AX115S4F45E3LG are focused on providing reliable, high-performance solutions for the ever-evolving technology landscape. The chip model is designed to provide the ultimate in performance and reliability, while also reducing power consumption.
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2,106 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $21,706.3202 | $21,706.3202 |
| 10+ | $21,472.9190 | $214,729.1896 |
| 100+ | $20,305.9125 | $2,030,591.2491 |
| 1000+ | $19,138.9060 | $9,569,453.0130 |
| 10000+ | $17,505.0970 | $17,505,096.9750 |
| The price is for reference only, please refer to the actual quotation! | ||