10AX115S2F45I1SG
10AX115S2F45I1SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX115S2F45I1SG


10AX115S2F45I1SG
F18-10AX115S2F45I1SG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1932,44X44,40
BGA, BGA1932,44X44,40

10AX115S2F45I1SG ECAD Model


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10AX115S2F45I1SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 624
Number of Outputs 624
Number of Logic Cells 1150000
Number of CLBs 42720
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology TSMC
Organization 42720 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1932
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1932
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1932,44X44,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 45 mm
Length 45 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1932,44X44,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX115S2F45I1SG Datasheet Download


10AX115S2F45I1SG Overview



The chip model 10AX115S2F45I1SG is a state-of-the-art product developed by a leading chip manufacturer. It is a high-performance, low-power, and highly integrated system-on-chip (SoC) solution, which is suitable for a wide range of applications, including industrial, communication, and consumer electronics. It is designed to meet the needs of advanced communication systems and provide a reliable platform for product development.


The 10AX115S2F45I1SG chip model provides several advantages, including a wide range of interfaces and high-speed data processing capabilities. It is also designed with low power consumption, making it an ideal choice for a wide range of applications. Additionally, the chip model has built-in advanced security features, making it an ideal choice for secure communication systems.


In addition, the 10AX115S2F45I1SG chip model is designed with the latest industry trends in mind. It supports the latest technologies, such as 5G, Wi-Fi 6, and Bluetooth 5.0, which are essential for advanced communication systems. It also supports the latest standards, such as the Internet of Things (IoT) and the Industrial Internet of Things (IIoT). This makes it an ideal choice for developing advanced communication systems.


The 10AX115S2F45I1SG chip model is designed for long-term use and can be upgraded to meet the needs of future applications. It is designed to be able to support new technologies as they become available, making it an ideal choice for future-proof applications. Additionally, it is designed to be compatible with future standards, such as the 5G standard, making it an ideal choice for advanced communication systems.


Overall, the 10AX115S2F45I1SG chip model is a highly reliable and advanced SoC solution that is suitable for a wide range of applications. It is designed to meet the needs of advanced communication systems and provide a reliable platform for product development. It is also designed with the latest industry trends in mind, which makes it an ideal choice for future-proof applications. Additionally, it is designed to be able to support new technologies as they become available, making it an ideal choice for advanced communication systems.



3,426 In Stock


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Unit Price: $5,537.6592
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $5,150.0231 $5,150.0231
10+ $5,094.6465 $50,946.4646
100+ $4,817.7635 $481,776.3504
1000+ $4,540.8805 $2,270,440.2720
10000+ $4,153.2444 $4,153,244.4000
The price is for reference only, please refer to the actual quotation!

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