
Intel Corporation
10AX115S2F45I1SG
10AX115S2F45I1SG ECAD Model
10AX115S2F45I1SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 624 | |
Number of Outputs | 624 | |
Number of Logic Cells | 1150000 | |
Number of CLBs | 42720 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 42720 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1932 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1932 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1932,44X44,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1932,44X44,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX115S2F45I1SG Datasheet Download
10AX115S2F45I1SG Overview
The chip model 10AX115S2F45I1SG is a state-of-the-art product developed by a leading chip manufacturer. It is a high-performance, low-power, and highly integrated system-on-chip (SoC) solution, which is suitable for a wide range of applications, including industrial, communication, and consumer electronics. It is designed to meet the needs of advanced communication systems and provide a reliable platform for product development.
The 10AX115S2F45I1SG chip model provides several advantages, including a wide range of interfaces and high-speed data processing capabilities. It is also designed with low power consumption, making it an ideal choice for a wide range of applications. Additionally, the chip model has built-in advanced security features, making it an ideal choice for secure communication systems.
In addition, the 10AX115S2F45I1SG chip model is designed with the latest industry trends in mind. It supports the latest technologies, such as 5G, Wi-Fi 6, and Bluetooth 5.0, which are essential for advanced communication systems. It also supports the latest standards, such as the Internet of Things (IoT) and the Industrial Internet of Things (IIoT). This makes it an ideal choice for developing advanced communication systems.
The 10AX115S2F45I1SG chip model is designed for long-term use and can be upgraded to meet the needs of future applications. It is designed to be able to support new technologies as they become available, making it an ideal choice for future-proof applications. Additionally, it is designed to be compatible with future standards, such as the 5G standard, making it an ideal choice for advanced communication systems.
Overall, the 10AX115S2F45I1SG chip model is a highly reliable and advanced SoC solution that is suitable for a wide range of applications. It is designed to meet the needs of advanced communication systems and provide a reliable platform for product development. It is also designed with the latest industry trends in mind, which makes it an ideal choice for future-proof applications. Additionally, it is designed to be able to support new technologies as they become available, making it an ideal choice for advanced communication systems.
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3,426 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $5,150.0231 | $5,150.0231 |
10+ | $5,094.6465 | $50,946.4646 |
100+ | $4,817.7635 | $481,776.3504 |
1000+ | $4,540.8805 | $2,270,440.2720 |
10000+ | $4,153.2444 | $4,153,244.4000 |
The price is for reference only, please refer to the actual quotation! |