Intel Corporation
10AX115S2F45E2LG
10AX115S2F45E2LG ECAD Model
10AX115S2F45E2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 624 | |
| Number of Outputs | 624 | |
| Number of Logic Cells | 1150000 | |
| Number of CLBs | 42720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 42720 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1932 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1932 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115S2F45E2LG Datasheet Download
10AX115S2F45E2LG Overview
The chip model 10AX115S2F45E2LG is a low-power, high-performance system-on-chip (SoC) that has been widely used in the industry. It is designed to meet the needs of the latest technology trends and provide a reliable and cost-effective solution for a variety of applications. This chip model is an important part of the development of intelligent robots in the future.
The 10AX115S2F45E2LG chip model is mainly used for embedded systems, such as smart home appliances, industrial automation, and robotics. It is a highly integrated SoC with low power consumption, high performance, and high reliability. This chip model has a wide range of features, including high-speed processing, low-power consumption, and high-performance graphics processing. It also supports a variety of communication protocols, such as Wi-Fi, Bluetooth, and Zigbee.
In terms of industry trends, the 10AX115S2F45E2LG chip model has been widely used in the industry and is expected to continue to be in demand in the future. This chip model has the potential to be used in a wide range of applications, such as smart home appliances, industrial automation, and robotics. In addition, the chip model is expected to be used in the development and popularization of future intelligent robots.
In order to use the 10AX115S2F45E2LG chip model effectively, certain technical talents are needed. These include knowledge of embedded systems, such as software engineering, hardware design, and programming. Additionally, knowledge of communication protocols, such as Wi-Fi, Bluetooth, and Zigbee, is also necessary. Furthermore, knowledge of artificial intelligence and machine learning is also important in order to develop and implement intelligent robots.
Overall, the 10AX115S2F45E2LG chip model is an important part of the development of intelligent robots in the future. It is expected to continue to be in demand in the industry and is a reliable and cost-effective solution for a variety of applications. In order to use this chip model effectively, certain technical talents are needed, such as knowledge of embedded systems, communication protocols, and artificial intelligence and machine learning.
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3,927 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $31,258.3440 | $31,258.3440 |
| 10+ | $30,922.2328 | $309,222.3279 |
| 100+ | $29,241.6767 | $2,924,167.6662 |
| 1000+ | $27,561.1205 | $13,780,560.2660 |
| 10000+ | $25,208.3420 | $25,208,341.9500 |
| The price is for reference only, please refer to the actual quotation! | ||