Intel Corporation
10AX115S1F45E1SG
10AX115S1F45E1SG ECAD Model
10AX115S1F45E1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 624 | |
| Number of Outputs | 624 | |
| Number of Logic Cells | 1150000 | |
| Number of CLBs | 42720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 42720 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1932 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1932 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115S1F45E1SG Datasheet Download
10AX115S1F45E1SG Overview
The chip model 10AX115S1F45E1SG is a highly advanced semiconductor device that has seen widespread use in the industry over the past few years. It is designed for use in a wide range of applications, from communications and networking to consumer electronics and industrial automation. Its versatile design and wide range of features make it a popular choice among manufacturers and users alike.
The chip model 10AX115S1F45E1SG is designed to be used in a wide range of environments, from low-power, low-cost applications to high-performance, high-end applications. It is capable of handling high-speed data transmissions, as well as providing efficient power consumption. It is also designed for use in a wide range of scenarios, from simple home networks to complex enterprise-level networks.
In terms of industry trends, the chip model 10AX115S1F45E1SG is likely to remain a popular choice for a wide range of applications. Its versatility and wide range of features make it an ideal choice for many different applications. In addition, its low power consumption and efficient data transmission make it a great choice for applications that require low-power, low-cost solutions.
The chip model 10AX115S1F45E1SG is also likely to be used in a wide range of intelligent scenarios in the future. Its versatile design and wide range of features make it an ideal choice for applications that require a high degree of intelligence. For example, it can be used in smart home networks, autonomous vehicles, and other intelligent systems.
In terms of product description and design requirements, the chip model 10AX115S1F45E1SG is designed to be highly reliable and efficient. It is designed to be used in a wide range of environments, from low-power, low-cost applications to high-performance, high-end applications. It is also designed to be compatible with a wide range of technologies, including Wi-Fi, Bluetooth, and more.
In addition to the product description and design requirements, there are also several case studies and precautions that must be taken into consideration when using the chip model 10AX115S1F45E1SG. For example, it is important to ensure that the chip is properly cooled in order to prevent overheating, as well as to ensure that the chip is not exposed to extreme temperatures or humidity. In addition, it is important to ensure that the chip is properly shielded from electromagnetic interference.
Overall, the chip model 10AX115S1F45E1SG is a highly advanced semiconductor device that has seen widespread use in the industry over the past few years. Its versatile design and wide range of features make it a popular choice among manufacturers and users alike. In terms of industry trends, the chip model 10AX115S1F45E1SG is likely to remain a popular choice for a wide range of applications. It is also likely to be used in a wide range of intelligent scenarios in the future. Finally, it is important to take into consideration the product description and design requirements, as well as several case studies and precautions when using the chip model 10AX115S1F45E1SG.
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2,822 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $38,903.6740 | $38,903.6740 |
| 10+ | $38,485.3549 | $384,853.5490 |
| 100+ | $36,393.7595 | $3,639,375.9525 |
| 1000+ | $34,302.1642 | $17,151,082.0750 |
| 10000+ | $31,373.9306 | $31,373,930.6250 |
| The price is for reference only, please refer to the actual quotation! | ||