Intel Corporation
10AX115R4F40E3SG
10AX115R4F40E3SG ECAD Model
10AX115R4F40E3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Technology | TSMC | |
| Operating Temperature-Max | 100 °C | |
| Number of Terminals | 1517 | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Pitch | 1 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.35 mm | |
| Width | 40 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B1517 | |
| Number of CLBs | 42720 | |
| Number of Inputs | 342 | |
| Number of Logic Cells | 1150000 | |
| Number of Outputs | 342 | |
| Organization | 42720 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Power Supplies | 900 mV | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| Supply Voltage-Nom | 900 mV | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
10AX115R4F40E3SG Datasheet Download
10AX115R4F40E3SG Overview
The chip model 10AX115R4F40E3SG is a powerful and versatile tool that has the potential to revolutionize the way networks and intelligent systems operate. It is designed to provide high performance and reliability in a wide variety of applications. The model is capable of handling complex tasks and can be used in a variety of intelligent scenarios.
The 10AX115R4F40E3SG chip model is designed to be used in the era of fully intelligent systems. It is designed to be powerful enough to handle complex tasks and provide reliable performance. The chip model is also designed to be flexible enough to be used in a variety of intelligent scenarios. This flexibility makes it ideal for a wide range of applications, from robotics to artificial intelligence.
The 10AX115R4F40E3SG chip model is also suitable for the development and popularization of future intelligent robots. It is capable of handling complex tasks and can be used in a variety of intelligent scenarios. This makes it ideal for the development of robots that can perform complex tasks and interact with their environment.
In order to effectively use the 10AX115R4F40E3SG chip model, technical talents are needed. These talents include programming, engineering, and design skills. In addition, knowledge of the chip model and its capabilities is also necessary in order to make the most of its potential.
The 10AX115R4F40E3SG chip model is a powerful tool that can be used to revolutionize the way networks and intelligent systems operate. It is designed to provide high performance and reliability in a wide variety of applications. It is also suitable for the development and popularization of future intelligent robots. In order to effectively use the 10AX115R4F40E3SG chip model, technical talents are needed. Careful consideration should be given to the product description and specific design requirements of the chip model, along with actual case studies and precautions. With the right technical talents and knowledge, the 10AX115R4F40E3SG chip model can be used to create powerful and reliable networks and intelligent systems.
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2,768 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $16,822.1564 | $16,822.1564 |
| 10+ | $16,641.2730 | $166,412.7298 |
| 100+ | $15,736.8560 | $1,573,685.5974 |
| 1000+ | $14,832.4390 | $7,416,219.4820 |
| 10000+ | $13,566.2552 | $13,566,255.1500 |
| The price is for reference only, please refer to the actual quotation! | ||