Intel Corporation
10AX115R3F40E2SG
10AX115R3F40E2SG ECAD Model
10AX115R3F40E2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 342 | |
| Number of Outputs | 342 | |
| Number of Logic Cells | 1150000 | |
| Number of CLBs | 42720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 42720 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115R3F40E2SG Datasheet Download
10AX115R3F40E2SG Overview
The chip model 10AX115R3F40E2SG is a high-performance digital signal processor designed for embedded processing, image processing, and other applications. It is designed to be programmed using the HDL language and provides a high-performance, low-power solution for a wide range of applications.
The 10AX115R3F40E2SG chip model is an ideal choice for high-performance digital signal processing. It has a high-speed, low-power processor architecture that is optimized for embedded processing and image processing applications. The chip model also provides a wide range of features, such as high-speed memory, on-chip peripherals, and multiple I/O ports.
The original design intention of the 10AX115R3F40E2SG chip model was to provide a high-performance, low-power solution for embedded processing and image processing applications. It was designed to be programmed using the HDL language, and it is capable of handling complex algorithms and data processing tasks. The chip model also provides a wide range of features and performance optimizations that make it suitable for a wide range of applications.
The 10AX115R3F40E2SG chip model also has the potential for future upgrades. It is capable of being used in advanced communication systems and can be upgraded to support new technologies. The industry trends of the chip model and the future development of related industries will depend on what specific technologies are needed and how they can be implemented.
In conclusion, the 10AX115R3F40E2SG chip model is a high-performance, low-power solution for embedded processing and image processing applications. It is designed to be programmed using the HDL language and provides a wide range of features and performance optimizations. The chip model also has the potential for future upgrades and can be used in advanced communication systems. The industry trends and the future development of related industries will depend on the specific technologies needed and how they can be implemented.
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3,587 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,084.5012 | $5,084.5012 |
| 10+ | $5,029.8292 | $50,298.2915 |
| 100+ | $4,756.4689 | $475,646.8872 |
| 1000+ | $4,483.1086 | $2,241,554.2960 |
| 10000+ | $4,100.4042 | $4,100,404.2000 |
| The price is for reference only, please refer to the actual quotation! | ||