10AX115R3F40E2LG
10AX115R3F40E2LG
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rohs

Intel Corporation

10AX115R3F40E2LG


10AX115R3F40E2LG
F18-10AX115R3F40E2LG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1517,39X39,40
BGA, BGA1517,39X39,40

10AX115R3F40E2LG ECAD Model


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10AX115R3F40E2LG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 342
Number of Outputs 342
Number of Logic Cells 1150000
Number of CLBs 42720
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 42720 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1517
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1517,39X39,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX115R3F40E2LG Datasheet Download


10AX115R3F40E2LG Overview



The chip model 10AX115R3F40E2LG is a high-performance digital signal processor that is designed to provide powerful computing capabilities for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. This chip model is designed to provide a powerful and efficient platform for the development of advanced communication systems.


The original design intention of the chip model 10AX115R3F40E2LG is to provide a high-performance platform for the development of advanced communication systems. It is designed to provide a powerful yet efficient platform for the development of high-performance digital signal processing applications. It is also designed to provide a platform for the development of embedded processing and image processing applications. The chip model also has the potential to be upgraded in the future, allowing it to be used in more advanced communication systems.


The chip model 10AX115R3F40E2LG can be used in a variety of network and intelligent scenarios. It can be used in the development of advanced communication systems, allowing for powerful and efficient data transmission between devices. It can also be used in the development of intelligent systems, allowing for the development of more efficient and intelligent algorithms. In the era of fully intelligent systems, the chip model can be used to provide powerful computing capabilities for the development of more advanced algorithms and applications.


Overall, the chip model 10AX115R3F40E2LG is a powerful and efficient platform for the development of advanced communication systems and intelligent systems. It is designed to provide a powerful and efficient platform for the development of high-performance digital signal processing applications and other applications that require the use of HDL language. It also has the potential to be upgraded in the future, allowing it to be used in more advanced communication systems. It can also be used in a variety of network and intelligent scenarios, allowing for the development of more efficient and intelligent algorithms.



4,675 In Stock


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Unit Price: $6,834.4264
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Pricing (USD)

QTY Unit Price Ext Price
1+ $6,356.0166 $6,356.0166
10+ $6,287.6723 $62,876.7229
100+ $5,945.9510 $594,595.0968
1000+ $5,604.2296 $2,802,114.8240
10000+ $5,125.8198 $5,125,819.8000
The price is for reference only, please refer to the actual quotation!

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