
Intel Corporation
10AX115R3F40E2LG
10AX115R3F40E2LG ECAD Model
10AX115R3F40E2LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 342 | |
Number of Outputs | 342 | |
Number of Logic Cells | 1150000 | |
Number of CLBs | 42720 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 42720 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1517,39X39,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX115R3F40E2LG Datasheet Download
10AX115R3F40E2LG Overview
The chip model 10AX115R3F40E2LG is a high-performance digital signal processor that is designed to provide powerful computing capabilities for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. This chip model is designed to provide a powerful and efficient platform for the development of advanced communication systems.
The original design intention of the chip model 10AX115R3F40E2LG is to provide a high-performance platform for the development of advanced communication systems. It is designed to provide a powerful yet efficient platform for the development of high-performance digital signal processing applications. It is also designed to provide a platform for the development of embedded processing and image processing applications. The chip model also has the potential to be upgraded in the future, allowing it to be used in more advanced communication systems.
The chip model 10AX115R3F40E2LG can be used in a variety of network and intelligent scenarios. It can be used in the development of advanced communication systems, allowing for powerful and efficient data transmission between devices. It can also be used in the development of intelligent systems, allowing for the development of more efficient and intelligent algorithms. In the era of fully intelligent systems, the chip model can be used to provide powerful computing capabilities for the development of more advanced algorithms and applications.
Overall, the chip model 10AX115R3F40E2LG is a powerful and efficient platform for the development of advanced communication systems and intelligent systems. It is designed to provide a powerful and efficient platform for the development of high-performance digital signal processing applications and other applications that require the use of HDL language. It also has the potential to be upgraded in the future, allowing it to be used in more advanced communication systems. It can also be used in a variety of network and intelligent scenarios, allowing for the development of more efficient and intelligent algorithms.
You May Also Be Interested In
4,675 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $6,356.0166 | $6,356.0166 |
10+ | $6,287.6723 | $62,876.7229 |
100+ | $5,945.9510 | $594,595.0968 |
1000+ | $5,604.2296 | $2,802,114.8240 |
10000+ | $5,125.8198 | $5,125,819.8000 |
The price is for reference only, please refer to the actual quotation! |