
Intel Corporation
10AX115R2F40I1SG
10AX115R2F40I1SG ECAD Model
10AX115R2F40I1SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 342 | |
Number of Outputs | 342 | |
Number of Logic Cells | 1150000 | |
Number of CLBs | 42720 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 42720 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1517,39X39,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX115R2F40I1SG Datasheet Download
10AX115R2F40I1SG Overview
The chip model 10AX115R2F40I1SG is a high-performance, low-power chip designed for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other related applications. It requires the use of HDL language, which is a hardware description language used to describe the structure and behavior of digital systems.
The chip model 10AX115R2F40I1SG offers a number of advantages that make it a popular choice for many applications. It has a robust design, allowing it to handle complex tasks and processes with ease. It also has a low power consumption, making it an ideal choice for applications that require energy efficiency. Furthermore, its high-performance capabilities make it well-suited for applications that require fast processing speeds.
The chip model 10AX115R2F40I1SG is expected to become even more popular in the future, as the demand for high-performance chips increases. This demand is driven by the need for faster, more efficient processing, as well as the need for more reliable data storage. As the demand for these chips grows, the chip model 10AX115R2F40I1SG is likely to become even more popular.
The chip model 10AX115R2F40I1SG is also likely to be used in a variety of network-based applications in the future. It is well-suited for applications such as network security, data transmission, and routing. Furthermore, it is likely to be used in intelligent scenarios such as machine learning and artificial intelligence. With its high-performance capabilities, the chip model 10AX115R2F40I1SG is likely to be a key component in the development of fully intelligent systems.
Overall, the chip model 10AX115R2F40I1SG is a powerful and energy-efficient chip that is well-suited for a variety of applications. It is expected to become even more popular in the future, as the demand for high-performance chips increases. Furthermore, it is likely to be used in a variety of network-based applications, as well as in intelligent scenarios such as machine learning and artificial intelligence. As such, the chip model 10AX115R2F40I1SG is likely to be a key component in the development of fully intelligent systems in the future.
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3,652 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $32,294.6034 | $32,294.6034 |
10+ | $31,947.3496 | $319,473.4960 |
100+ | $30,211.0806 | $3,021,108.0600 |
1000+ | $28,474.8116 | $14,237,405.8000 |
10000+ | $26,044.0350 | $26,044,035.0000 |
The price is for reference only, please refer to the actual quotation! |