10AX115R2F40I1SG
10AX115R2F40I1SG
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rohs

Intel Corporation

10AX115R2F40I1SG


10AX115R2F40I1SG
F18-10AX115R2F40I1SG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1517,39X39,40
BGA, BGA1517,39X39,40

10AX115R2F40I1SG ECAD Model


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10AX115R2F40I1SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 342
Number of Outputs 342
Number of Logic Cells 1150000
Number of CLBs 42720
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology TSMC
Organization 42720 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1517
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1517,39X39,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX115R2F40I1SG Datasheet Download


10AX115R2F40I1SG Overview



The chip model 10AX115R2F40I1SG is a high-performance, low-power chip designed for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other related applications. It requires the use of HDL language, which is a hardware description language used to describe the structure and behavior of digital systems.


The chip model 10AX115R2F40I1SG offers a number of advantages that make it a popular choice for many applications. It has a robust design, allowing it to handle complex tasks and processes with ease. It also has a low power consumption, making it an ideal choice for applications that require energy efficiency. Furthermore, its high-performance capabilities make it well-suited for applications that require fast processing speeds.


The chip model 10AX115R2F40I1SG is expected to become even more popular in the future, as the demand for high-performance chips increases. This demand is driven by the need for faster, more efficient processing, as well as the need for more reliable data storage. As the demand for these chips grows, the chip model 10AX115R2F40I1SG is likely to become even more popular.


The chip model 10AX115R2F40I1SG is also likely to be used in a variety of network-based applications in the future. It is well-suited for applications such as network security, data transmission, and routing. Furthermore, it is likely to be used in intelligent scenarios such as machine learning and artificial intelligence. With its high-performance capabilities, the chip model 10AX115R2F40I1SG is likely to be a key component in the development of fully intelligent systems.


Overall, the chip model 10AX115R2F40I1SG is a powerful and energy-efficient chip that is well-suited for a variety of applications. It is expected to become even more popular in the future, as the demand for high-performance chips increases. Furthermore, it is likely to be used in a variety of network-based applications, as well as in intelligent scenarios such as machine learning and artificial intelligence. As such, the chip model 10AX115R2F40I1SG is likely to be a key component in the development of fully intelligent systems in the future.



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Unit Price: $34,725.38
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $32,294.6034 $32,294.6034
10+ $31,947.3496 $319,473.4960
100+ $30,211.0806 $3,021,108.0600
1000+ $28,474.8116 $14,237,405.8000
10000+ $26,044.0350 $26,044,035.0000
The price is for reference only, please refer to the actual quotation!

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