
Intel Corporation
10AX115R2F40E1SG
10AX115R2F40E1SG ECAD Model
10AX115R2F40E1SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 342 | |
Number of Outputs | 342 | |
Number of Logic Cells | 1150000 | |
Number of CLBs | 42720 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 42720 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1517,39X39,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX115R2F40E1SG Datasheet Download
10AX115R2F40E1SG Overview
The chip model 10AX115R2F40E1SG is a highly advanced chip designed to meet the needs of modern communication systems. It features advanced features such as high-speed data processing, low power consumption, and excellent signal integrity. The chip is designed to be used in a wide range of applications from basic networking to advanced communication systems.
The original design intention of the chip model 10AX115R2F40E1SG was to provide a reliable and efficient solution for communication systems. It has been designed to be highly efficient and reliable in order to meet the demands of modern communication systems. The chip has been designed to be highly versatile and able to be used in a variety of applications. It is also capable of being upgraded in the future in order to meet the ever-changing needs of communication systems.
The chip model 10AX115R2F40E1SG can be applied to many intelligent scenarios, such as intelligent networks, autonomous vehicles, and smart home systems. It has the capability to process data quickly and accurately, making it an ideal solution for intelligent systems. It is also capable of being used in the era of fully intelligent systems, as it has the ability to process large amounts of data and provide accurate results.
The product description of the chip model 10AX115R2F40E1SG states that it is capable of providing high-speed data processing, low power consumption, and excellent signal integrity. It also has a wide range of features such as advanced signal processing, digital signal processing, and advanced communication protocols. In addition, the chip is designed to be highly reliable and efficient, making it an ideal solution for communication systems.
When using the chip model 10AX115R2F40E1SG, it is important to consider the specific design requirements of the application. This includes ensuring that the chip is able to process the data quickly and accurately, as well as ensuring that the chip is able to provide the required signal integrity. Additionally, it is important to consider the specific environment in which the chip will be used, as this can affect the performance of the chip.
In order to provide a better understanding of the chip model 10AX115R2F40E1SG, there are a number of case studies available. These case studies provide valuable information on how the chip has been used in various applications, as well as any potential problems that may arise when using the chip. Additionally, it is important to consider any potential safety precautions when using the chip, as it is a highly advanced piece of technology.
Overall, the chip model 10AX115R2F40E1SG is a highly advanced chip designed to meet the needs of modern communication systems. It is capable of providing high-speed data processing, low power consumption, and excellent signal integrity. It is also capable of being used in a wide range of applications, from basic networking to advanced communication systems. Additionally, it is capable of being upgraded in the future in order to meet the ever-changing needs of communication systems. Finally, it is important to consider the specific design requirements of the application, as well as any potential safety precautions when using the chip.
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2,752 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $28,256.2639 | $28,256.2639 |
10+ | $27,952.4331 | $279,524.3314 |
100+ | $26,433.2792 | $2,643,327.9165 |
1000+ | $24,914.1252 | $12,457,062.5950 |
10000+ | $22,787.3096 | $22,787,309.6250 |
The price is for reference only, please refer to the actual quotation! |