
Intel Corporation
10AX115R1F40E1SG
10AX115R1F40E1SG ECAD Model
10AX115R1F40E1SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 342 | |
Number of Outputs | 342 | |
Number of Logic Cells | 1150000 | |
Number of CLBs | 42720 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 42720 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1517,39X39,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX115R1F40E1SG Datasheet Download
10AX115R1F40E1SG Overview
The chip model 10AX115R1F40E1SG is a high-performance digital signal processor that is suitable for a variety of applications, including embedded processing, image processing, and so on. It requires the use of HDL language, which is a powerful tool for the development of digital systems. But the chip model 10AX115R1F40E1SG is not only limited to these applications. It can also be applied to networks, intelligent scenarios, and even the development and popularization of future intelligent robots.
The chip model 10AX115R1F40E1SG is highly capable of being applied to networks and intelligent scenarios. It can be used to process digital signals, which can be used to monitor and control networks, as well as to provide feedback to the user. It can also be used to develop and implement various intelligent scenarios, such as autonomous driving, facial recognition, and so on. In addition, it can be used in the era of fully intelligent systems, which is the future of computing.
The chip model 10AX115R1F40E1SG can also be applied to the development and popularization of future intelligent robots. It can be used to process large amounts of data quickly, which is essential for robots to be able to make decisions in real-time. It can also be used to process visual information, which can enable robots to recognize objects, people, and their environment. In addition, it can be used to develop algorithms that enable robots to learn from their environment and make decisions accordingly.
In order to use the chip model 10AX115R1F40E1SG effectively, certain technical talents are needed. It requires knowledge of HDL language and digital signal processing, as well as a good understanding of embedded systems and robotics. Furthermore, it requires knowledge of algorithms and machine learning, as well as a good understanding of the application of the chip model in networks and intelligent scenarios. All of these skills are essential for the successful development and popularization of future intelligent robots.
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4,753 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $7,549.4149 | $7,549.4149 |
10+ | $7,468.2384 | $74,682.3837 |
100+ | $7,062.3558 | $706,235.5848 |
1000+ | $6,656.4733 | $3,328,236.6640 |
10000+ | $6,088.2378 | $6,088,237.8000 |
The price is for reference only, please refer to the actual quotation! |