Intel Corporation
10AX115N4F40I3LG
10AX115N4F40I3LG ECAD Model
10AX115N4F40I3LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 1150000 | |
| Number of CLBs | 42720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 42720 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115N4F40I3LG Datasheet Download
10AX115N4F40I3LG Overview
The chip model 10AX115N4F40I3LG is a high-performance device specifically designed for digital signal processing, embedded processing, and image processing. It is capable of achieving a high level of performance by utilizing the HDL language, which is a hardware description language used to create complex digital circuits. The chip model 10AX115N4F40I3LG has several advantages over other similar chips, including high-speed processing, low power consumption, and a small form factor.
The demand for the chip model 10AX115N4F40I3LG is expected to grow in the coming years as more and more industries require the use of high-performance digital signal processing, embedded processing, and image processing. The chip model 10AX115N4F40I3LG is an ideal solution for these industries, as it offers superior performance and efficiency while still being cost-effective.
The original design intention of the chip model 10AX115N4F40I3LG was to provide a high-performance solution for digital signal processing, embedded processing, and image processing. The chip model 10AX115N4F40I3LG is highly customizable and can be upgraded to meet the changing demands of the industries it serves. This makes it an ideal choice for companies looking for a reliable and cost-effective solution.
The chip model 10AX115N4F40I3LG is also suitable for advanced communication systems, such as 5G networks. It has the capability to process high volumes of data quickly and efficiently, making it an ideal choice for companies looking to provide a reliable and high-performance communication system.
Overall, the chip model 10AX115N4F40I3LG is an ideal choice for companies looking for a reliable and high-performance solution for digital signal processing, embedded processing, and image processing. It is highly customizable and can be upgraded to meet the changing demands of the industries it serves. The chip model 10AX115N4F40I3LG is also suitable for advanced communication systems, making it an ideal choice for companies looking to provide a reliable and high-performance communication system.
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4,364 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $22,778.4538 | $22,778.4538 |
| 10+ | $22,533.5242 | $225,335.2421 |
| 100+ | $21,308.8762 | $2,130,887.6157 |
| 1000+ | $20,084.2281 | $10,042,114.0510 |
| 10000+ | $18,369.7208 | $18,369,720.8250 |
| The price is for reference only, please refer to the actual quotation! | ||