Intel Corporation
10AX115N3F45E2LG
10AX115N3F45E2LG ECAD Model
10AX115N3F45E2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 768 | |
| Number of Outputs | 768 | |
| Number of Logic Cells | 1150000 | |
| Number of CLBs | 42720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 42720 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1932 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1932 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115N3F45E2LG Datasheet Download
10AX115N3F45E2LG Overview
The chip model 10AX115N3F45E2LG is a product of the rapidly advancing chip market and is a part of a larger industry trend. This chip is a new generation of high-performance, low-power microprocessors that have become increasingly popular in the consumer electronics and communications industry. It is designed to provide reliable performance while consuming less power and has the ability to be used in a variety of applications.
The 10AX115N3F45E2LG chip model is designed to provide a variety of features that make it suitable for use in a variety of applications. Its features include a powerful ARM Cortex-A53 processor, a high-bandwidth memory interface, and a low-power design. This chip model also supports advanced communication technologies such as Wi-Fi, Bluetooth, and 4G LTE. It is designed to be used in a variety of applications such as consumer electronics, automotive, and industrial applications.
In terms of future developments, the 10AX115N3F45E2LG chip model is designed to be upgradable and can be used in advanced communication systems. The chip model is designed to be able to support new technologies and applications such as 5G, Internet of Things (IoT), and Artificial Intelligence (AI). This chip model is also designed to be compatible with a variety of operating systems and can be used in a variety of applications.
The product description of the 10AX115N3F45E2LG chip model includes a variety of features that make it suitable for use in a variety of applications. It is designed to be used in consumer electronics, automotive, and industrial applications. It is also designed to be upgradable and can be used in advanced communication systems. The chip model also supports advanced communication technologies such as Wi-Fi, Bluetooth, and 4G LTE.
Actual case studies of the 10AX115N3F45E2LG chip model can be found in a variety of applications. For example, the chip model has been used in consumer electronics such as mobile phones, tablets, and wearable devices. It has also been used in automotive applications such as automotive infotainment systems and in industrial applications such as industrial robots and automation systems.
When using the 10AX115N3F45E2LG chip model, there are some precautions that should be taken. It is important to ensure that the chip model is compatible with the application it is being used in and that the chip model is suitable for the application's requirements. It is also important to ensure that the chip model is properly installed and configured and that any updates or upgrades are done properly. Additionally, it is important to ensure that the chip model is being used in the correct environment and is not being exposed to any extreme temperatures or conditions.
In conclusion, the 10AX115N3F45E2LG chip model is a part of the rapidly advancing chip market and is designed to provide reliable performance while consuming less power. It is suitable for use in a variety of applications such as consumer electronics, automotive, and industrial applications. It is also designed to be upgradable and can be used in advanced communication systems. When using the 10AX115N3F45E2LG chip model, it is important to ensure that it is compatible with the application it is being used in and that it is properly installed and configured.
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1,296 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $25,683.0454 | $25,683.0454 |
| 10+ | $25,406.8837 | $254,068.8367 |
| 100+ | $24,026.0748 | $2,402,607.4773 |
| 1000+ | $22,645.2659 | $11,322,632.9390 |
| 10000+ | $20,712.1334 | $20,712,133.4250 |
| The price is for reference only, please refer to the actual quotation! | ||