10AX115N3F40I2SGES
10AX115N3F40I2SGES
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Intel Corporation

10AX115N3F40I2SGES


10AX115N3F40I2SGES
F18-10AX115N3F40I2SGES
Active
IC FPGA 600 I/O 1517FCBGA
1517-FCBGA (40x40)

10AX115N3F40I2SGES ECAD Model


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10AX115N3F40I2SGES Attributes


Type Description Select
Mfr Intel
Series Arria 10 GX
Package Tray
Number of LABs/CLBs 427200
Number of Logic Elements/Cells 1150000
Total RAM Bits 68857856
Number of I/O 600
Voltage - Supply 0.87V ~ 0.93V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FCBGA (40x40)

10AX115N3F40I2SGES Datasheet Download


10AX115N3F40I2SGES Overview



The 10AX115N3F40I2SGES is an advanced chip model from the 10AX family of Field Programmable Gate Arrays (FPGAs). This chip is designed for applications requiring high-speed data processing and is suitable for a wide range of applications such as video, audio, communication, and industrial control.


The 10AX115N3F40I2SGES is a single-chip device that contains over 115,000 logic elements and up to 40,000 embedded memory blocks. It has a total of 10,000 I/O pins, with 2.5 Gbps transceivers and up to 10.3 Gbps SerDes. The 10AX115N3F40I2SGES also features a dedicated high-speed LVDS interface, which allows for fast data transmission and communication.


The 10AX115N3F40I2SGES is designed to operate at a maximum frequency of 800 MHz and is capable of providing up to 1.25 TFLOPS of digital signal processing power. It has a low power consumption of less than 4W and is available in a variety of packages, including the BGA and QFN packages.


The 10AX115N3F40I2SGES is suitable for a variety of applications, including video and audio processing, communication, industrial control, and automotive applications. It is also suitable for high-speed data processing and can be used in a variety of systems, such as networking, storage, and embedded systems.



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