Intel Corporation
10AX115N3F40I2SG
10AX115N3F40I2SG ECAD Model
10AX115N3F40I2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 1150000 | |
| Number of CLBs | 42720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 42720 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115N3F40I2SG Datasheet Download
10AX115N3F40I2SG Overview
The chip model 10AX115N3F40I2SG is a cutting edge semiconductor device designed for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. Its advanced design makes it suitable for a variety of complex tasks, making it a popular choice for many industries.
The 10AX115N3F40I2SG is designed to be programmed with HDL (Hardware Description Language) and requires a specific set of technologies to be supported in the application environment. This allows the chip to be used in a wide range of applications, from consumer electronics to industrial automation.
The 10AX115N3F40I2SG is designed to be highly efficient and reliable, making it an ideal choice for many different industries. It can handle a variety of tasks, from data processing to image processing, and its advanced design ensures that it can do so quickly and accurately.
The 10AX115N3F40I2SG is also designed to be highly scalable, allowing it to be used in a variety of different environments. This makes it a great choice for both large and small businesses, and its flexibility allows it to be used in many different applications.
When it comes to the industry trends of the 10AX115N3F40I2SG, the chip is designed to be used in a wide range of applications, from consumer electronics to industrial automation. As such, it is likely that new technologies will be required to support the application environment.
When it comes to product description and specific design requirements of the 10AX115N3F40I2SG, the chip is designed to be highly efficient and reliable, and its advanced design ensures that it can do a variety of tasks quickly and accurately. It is also designed to be highly scalable, allowing it to be used in a variety of different environments.
When it comes to actual case studies and precautions, the 10AX115N3F40I2SG is designed to be used in a wide range of applications, from consumer electronics to industrial automation. As such, it is important to ensure that the application environment is properly designed and that the chip is used in accordance with the manufacturer's instructions.
In conclusion, the 10AX115N3F40I2SG is a cutting edge semiconductor device designed for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed with HDL and requires a specific set of technologies to be supported in the application environment. Its advanced design makes it suitable for a variety of complex tasks, making it a popular choice for many industries. It is important to ensure that the application environment is properly designed and that the chip is used in accordance with the manufacturer's instructions.
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4,787 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $23,379.4557 | $23,379.4557 |
| 10+ | $23,128.0637 | $231,280.6372 |
| 100+ | $21,871.1037 | $2,187,110.3739 |
| 1000+ | $20,614.1438 | $10,307,071.8770 |
| 10000+ | $18,854.3998 | $18,854,399.7750 |
| The price is for reference only, please refer to the actual quotation! | ||