Intel Corporation
10AX115N3F40E2SG
10AX115N3F40E2SG ECAD Model
10AX115N3F40E2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 1150000 | |
| Number of CLBs | 42720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 42720 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115N3F40E2SG Datasheet Download
10AX115N3F40E2SG Overview
The chip model 10AX115N3F40E2SG is a powerful, versatile, and efficient chip model that has been designed to meet the needs of various industries. It has a wide range of features and capabilities, making it an ideal choice for a variety of applications. The chip model is designed to be highly efficient, providing excellent performance at a low cost. Additionally, the chip model is designed to be highly reliable, providing a long-term solution for users.
The chip model 10AX115N3F40E2SG has a number of advantages that make it an attractive choice for a variety of industries. The chip model has a high level of integration, meaning it is capable of performing multiple functions simultaneously. Additionally, the chip model is designed to be highly scalable, allowing it to be adapted to different applications. The chip model is also designed to be highly efficient, providing excellent performance at a low cost. Furthermore, the chip model has a high level of reliability, making it an ideal choice for long-term solutions.
The chip model 10AX115N3F40E2SG is expected to see increasing demand in the future, as more industries begin to recognize the advantages of the chip model. The chip model is designed to be highly efficient, providing excellent performance at a low cost. Additionally, the chip model is designed to be highly reliable, providing a long-term solution for users. Furthermore, the chip model is designed to be highly scalable, allowing it to be adapted to different applications. As such, the chip model is expected to be increasingly sought after by a variety of industries.
The original design intention of the chip model 10AX115N3F40E2SG was to provide a powerful and efficient solution for a variety of industries. The chip model is designed to be highly efficient, providing excellent performance at a low cost. Additionally, the chip model is designed to be highly reliable, providing a long-term solution for users. Furthermore, the chip model is designed to be highly scalable, allowing it to be adapted to different applications. As such, the chip model was designed to meet the needs of a variety of industries.
The chip model 10AX115N3F40E2SG has the potential to be upgraded in the future, allowing it to be used in advanced communication systems. The chip model is designed to be highly efficient, providing excellent performance at a low cost. Additionally, the chip model is designed to be highly reliable, providing a long-term solution for users. Furthermore, the chip model is designed to be highly scalable, allowing it to be adapted to different applications. As such, the chip model has the potential to be upgraded in the future, allowing it to be used in advanced communication systems.
The chip model 10AX115N3F40E2SG has the potential to be used in a variety of networks and intelligent scenarios. The chip model is designed to be highly efficient, providing excellent performance at a low cost. Additionally, the chip model is designed to be highly reliable, providing a long-term solution for users. Furthermore, the chip model is designed to be highly scalable, allowing it to be adapted to different applications. As such, the chip model has the potential to be used in a variety of networks and intelligent scenarios.
The chip model 10AX115N3F40E2SG has the potential to be used in the era of fully intelligent systems. The chip model is designed to be highly efficient, providing excellent performance at a low cost. Additionally, the chip model is designed to be highly reliable, providing a long-term solution for users. Furthermore, the chip model is designed to be highly scalable, allowing it to be adapted to different applications. As such, the chip model has the potential to be used in the era of fully intelligent systems.
In conclusion, the chip model 10AX115N3F40E2SG is a powerful and efficient chip model that has been designed to meet the needs of various industries. The chip model has a number of advantages, including a high level of integration, scalability, and reliability. Additionally, the chip model has the potential to be upgraded in the future, allowing it to be used in advanced communication systems. Furthermore, the chip model has the potential to be used in a variety of networks and intelligent scenarios, as well as in the era of fully intelligent systems. As such, it is expected to see increasing demand in the future, as more industries begin to recognize the advantages of the chip model.
You May Also Be Interested In
4,652 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $20,039.5417 | $20,039.5417 |
| 10+ | $19,824.0628 | $198,240.6276 |
| 100+ | $18,746.6680 | $1,874,666.8041 |
| 1000+ | $17,669.2733 | $8,834,636.6630 |
| 10000+ | $16,160.9207 | $16,160,920.7250 |
| The price is for reference only, please refer to the actual quotation! | ||