
Intel Corporation
10AX115N3F40E2LG
10AX115N3F40E2LG ECAD Model
10AX115N3F40E2LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 600 | |
Number of Outputs | 600 | |
Number of Logic Cells | 1150000 | |
Number of CLBs | 42720 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 42720 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1517,39X39,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX115N3F40E2LG Datasheet Download
10AX115N3F40E2LG Overview
The chip model 10AX115N3F40E2LG is a state-of-the-art integrated circuit (IC) developed by a leading semiconductor company. It is designed to be used in the most advanced communication systems, and its original design intention is to provide a reliable and cost-effective solution for digital signal processing. The chip model is equipped with a wide range of features, including a high-speed data transfer rate, low power consumption, and high-efficiency signal processing. Additionally, it has the capability to support multiple applications simultaneously, allowing for greater flexibility and scalability.
The chip model 10AX115N3F40E2LG is highly capable and can be used in a variety of advanced communication systems. It is suitable for use in both wired and wireless networks, and its advanced signal processing capabilities make it a great choice for applications such as digital audio, video, and data transmission. Additionally, it can be used in the development and popularization of future intelligent robots, as its high-speed data transfer and low power consumption make it an ideal choice for robotics applications.
The chip model 10AX115N3F40E2LG is also capable of being upgraded in the future, allowing it to be used in the era of fully intelligent systems. It is capable of supporting a range of intelligent applications, such as facial recognition, voice recognition, and natural language processing. Additionally, its high-speed data transfer and low power consumption make it a great choice for the development and popularization of future intelligent robots. To use the chip model effectively, engineers and developers need to have a good understanding of digital signal processing, as well as a good understanding of the chip model's capabilities.
In conclusion, the chip model 10AX115N3F40E2LG is a powerful and reliable integrated circuit that can be used in a variety of advanced communication systems, as well as in the development and popularization of future intelligent robots. It is capable of being upgraded in the future and can support a range of intelligent applications. To use the chip model effectively, engineers and developers need to have a good understanding of digital signal processing and the chip model's capabilities.
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3,870 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $25,049.4261 | $25,049.4261 |
10+ | $24,780.0775 | $247,800.7746 |
100+ | $23,433.3341 | $2,343,333.4116 |
1000+ | $22,086.5908 | $11,043,295.3880 |
10000+ | $20,201.1501 | $20,201,150.1000 |
The price is for reference only, please refer to the actual quotation! |