Intel Corporation
10AX115N2F45I1SG
10AX115N2F45I1SG ECAD Model
10AX115N2F45I1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 768 | |
| Number of Outputs | 768 | |
| Number of Logic Cells | 1150000 | |
| Number of CLBs | 42720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 42720 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1932 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1932 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115N2F45I1SG Datasheet Download
10AX115N2F45I1SG Overview
The chip model 10AX115N2F45I1SG is a high-performance, low-cost chip that is ideal for applications in digital signal processing, embedded processing, image processing, and other areas. As a result, it is gaining popularity in the industry, and is expected to become even more popular in the future.
The chip model 10AX115N2F45I1SG uses the HDL language, which is a high-level language designed for hardware description and design. This language is used to create models of hardware components, and allows for the creation of complex digital systems. As a result, this chip model is particularly suitable for applications that require complex digital signal processing or embedded processing.
The chip model 10AX115N2F45I1SG also has several advantages that make it attractive for use in a wide range of applications. It is low-cost, yet highly reliable, and offers high performance. In addition, it is easy to use and can be integrated into existing systems with minimal effort.
The chip model 10AX115N2F45I1SG is expected to be in high demand in the future, as more and more applications require the use of high-performance digital signal processing, embedded processing, and image processing. As a result, the demand for this chip model is expected to increase in the future.
Whether the application environment requires the support of new technologies depends on the specific technologies needed. As new technologies emerge, the chip model 10AX115N2F45I1SG may need to be adapted to accommodate them. However, the chip model itself is highly reliable and can be used in a wide range of applications, so it is expected to remain popular in the future.
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1,410 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $29,887.2298 | $29,887.2298 |
| 10+ | $29,565.8617 | $295,658.6170 |
| 100+ | $27,959.0214 | $2,795,902.1394 |
| 1000+ | $26,352.1811 | $13,176,090.5420 |
| 10000+ | $24,102.6047 | $24,102,604.6500 |
| The price is for reference only, please refer to the actual quotation! | ||