
Intel Corporation
10AX115N2F45E2SG
10AX115N2F45E2SG ECAD Model
10AX115N2F45E2SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 768 | |
Number of Outputs | 768 | |
Number of Logic Cells | 1150000 | |
Number of CLBs | 42720 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 42720 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1932 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1932 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1932,44X44,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1932,44X44,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX115N2F45E2SG Datasheet Download
10AX115N2F45E2SG Overview
The chip model 10AX115N2F45E2SG is a state-of-the-art integrated circuit (IC) which has been developed to meet the growing demand for high-performance, low-power solutions in the industry. It is manufactured using advanced process technologies and is designed to meet the requirements of various applications. It is suitable for use in a wide range of applications, including those in the networking and communication industries.
The chip model 10AX115N2F45E2SG is designed to provide high-speed data transmission and enhanced performance. It is capable of operating at frequencies up to 1.2 GHz and supports a wide range of communication protocols, including Wi-Fi, Bluetooth, and Zigbee. It also supports various advanced technologies, such as dynamic frequency selection, dynamic power management, and advanced error correction. In addition, it has the ability to support numerous applications, including voice over IP, video streaming, and machine-to-machine communication.
When it comes to the industry trends of the chip model 10AX115N2F45E2SG and the future development of related industries, it is important to consider the specific technologies that are needed to support the application environment. Some of the technologies that may be required include artificial intelligence, machine learning, and 5G networks. As the demand for these technologies increases, the chip model 10AX115N2F45E2SG may be used in a variety of applications, including the development of autonomous vehicles, smart homes, and the Internet of Things.
The possible future applications of the chip model 10AX115N2F45E2SG in networks and intelligent scenarios can be explored by examining actual case studies and the design requirements of the chip. For example, the chip can be used in a variety of applications, including home automation, video surveillance, and industrial automation. It can also be used to support 5G networks and intelligent systems, such as those used in autonomous vehicles. Furthermore, the chip can support machine learning algorithms, enabling it to learn and adapt to changing environments.
When it comes to the product description and specific design requirements of the chip model 10AX115N2F45E2SG, it is important to consider the requirements of the application environment and the specific features that are needed to support the application. The chip is designed to provide a low-power, high-performance solution, and it is important to ensure that it is capable of meeting the requirements of the application. Additionally, it is important to consider the specific features that are needed to support the application, such as power management, error correction, and dynamic frequency selection.
In conclusion, the chip model 10AX115N2F45E2SG is a state-of-the-art integrated circuit which is designed to meet the requirements of various applications. It is capable of providing high-speed data transmission and enhanced performance, and it is suitable for use in a wide range of applications, including those in the networking and communication industries. In addition, it is important to consider the specific technologies that are needed to support the application environment, such as artificial intelligence, machine learning, and 5G networks. Finally, it is important to consider the product description and specific design requirements of the chip model 10AX115N2F45E2SG, as well as actual case studies and precautions, in order to ensure that it is capable of meeting the requirements of the application.
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5,376 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $22,414.5258 | $22,414.5258 |
10+ | $22,173.5094 | $221,735.0935 |
100+ | $20,968.4273 | $2,096,842.7322 |
1000+ | $19,763.3453 | $9,881,672.6460 |
10000+ | $18,076.2305 | $18,076,230.4500 |
The price is for reference only, please refer to the actual quotation! |