Intel Corporation
10AX115N2F40I2LG
10AX115N2F40I2LG ECAD Model
10AX115N2F40I2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 1150000 | |
| Number of CLBs | 42720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 42720 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115N2F40I2LG Datasheet Download
10AX115N2F40I2LG Overview
The chip model 10AX115N2F40I2LG is a cutting-edge integrated circuit (IC) designed by leading semiconductor manufacturer Xilinx. It is an advanced programmable system-on-chip (SoC) that integrates a wide range of components, including a powerful ARM Cortex-A9 processor, a Xilinx FPGA, and a variety of peripherals. This combination of features makes it suitable for a wide range of applications, from embedded systems to high-end communication systems.
The 10AX115N2F40I2LG is designed to be highly efficient, with a low power consumption and a high performance-to-power ratio. It is also highly customizable, allowing developers to tailor the chip to their specific application needs. This makes it an ideal solution for applications that require high performance, low power consumption, and flexibility.
In terms of industry trends, the 10AX115N2F40I2LG is expected to see increasing demand in the coming years. This is due to the increasing need for high-performance, low-power, and customizable solutions in a variety of applications. It is also expected that the chip will be used in advanced communication systems, as the chip is well-suited for this type of application.
The original design intention of the 10AX115N2F40I2LG was to provide a highly customizable, high-performance, and low-power solution for a wide range of applications. As technology advances, the chip is expected to be upgraded to keep up with the latest advances. This could include the addition of new peripherals, such as wireless communication, or the implementation of more advanced technologies.
Overall, the 10AX115N2F40I2LG is an advanced integrated circuit designed to provide high performance, low power consumption, and flexibility for a variety of applications. It is expected to see increasing demand in the coming years, and is well-suited to advanced communication systems. It is also expected to be upgraded in the future to take advantage of new technologies, making it an ideal solution for applications that require the latest technology.
You May Also Be Interested In
2,132 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $31,885.3104 | $31,885.3104 |
| 10+ | $31,542.4576 | $315,424.5760 |
| 100+ | $29,828.1936 | $2,982,819.3600 |
| 1000+ | $28,113.9296 | $14,056,964.8000 |
| 10000+ | $25,713.9600 | $25,713,960.0000 |
| The price is for reference only, please refer to the actual quotation! | ||